| Chemical effect on the material removal rate in the CMP of silicon wafers YG Wang, LC Zhang, A Biddut Wear 270 (3-4), 312-316, 2011 | 157 | 2011 |
| Effects of heat treatment on microstructure and mechanical properties of Ni60/h-BN self-lubricating anti-wear composite coatings on 304 stainless steel by laser cladding XL Lu, XB Liu, PC Yu, YJ Zhai, SJ Qiao, MD Wang, YG Wang, Y Chen Applied Surface Science 355, 350-358, 2015 | 74 | 2015 |
| Modeling the effects of particle deformation in chemical mechanical polishing X Chen, Y Zhao, Y Wang Applied surface science 258 (22), 8469-8474, 2012 | 59 | 2012 |
| A new nonlinear-micro-contact model for single particle in the chemical–mechanical polishing with soft pad Y Wang, YW Zhao, J Gu Journal of Materials Processing Technology 183 (2-3), 374-379, 2007 | 50 | 2007 |
| A chemical mechanical polishing model based on the viscous flow of the amorphous layer JZ Jiang, YW Zhao, YG Wang, JB Luo Wear 265 (7-8), 992-998, 2008 | 47 | 2008 |
| Modeling the effects of oxidizer, complexing agent and inhibitor on material removal for copper chemical mechanical polishing Y Wang, Y Zhao Applied Surface Science 254 (5), 1517-1523, 2007 | 44 | 2007 |
| Interfacial stress transfer in a graphene nanosheet toughened hydroxyapatite composite L Zhang, XG Zhang, Y Chen, JN Su, WW Liu, TH Zhang, F Qi, YG Wang Applied Physics Letters 105 (16), 2014 | 40 | 2014 |
| A material removal model for silicon oxide layers in chemical mechanical planarization considering the promoted chemical reaction by the down pressure Y Wang, Y Chen, F Qi, D Zhao, W Liu Tribology International 93, 11-16, 2016 | 36 | 2016 |
| Modeling effects of abrasive particle size and concentration on material removal at molecular scale in chemical mechanical polishing Y Wang, Y Zhao, W An, Z Ni, J Wang Applied Surface Science 257 (1), 249-253, 2010 | 36 | 2010 |
| Modeling the effects of abrasive size, surface oxidizer concentration and binding energy on chemical mechanical polishing at molecular scale Y Wang, Y Zhao, X Li Tribology international 41 (3), 202-210, 2008 | 32 | 2008 |
| Modeling effect of chemical–mechanical synergy on material removal at molecular scale in chemical mechanical polishing Y Wang, Y Zhao, J Jiang, X Li Wear 265 (5-6), 721-728, 2008 | 31 | 2008 |
| Nanoscale friction and wear properties of silicon wafer under different lubrication conditions X Chen, Y Zhao, Y Wang, H Zhou, Z Ni, W An Applied surface science 282, 25-31, 2013 | 30 | 2013 |
| Modeling the effects of cohesive energy for single particle on the material removal in chemical mechanical polishing at atomic scale Y Wang, Y Zhao, W An, J Wang Applied Surface Science 253 (23), 9137-9141, 2007 | 29 | 2007 |
| Nanoscratch of aluminum in dry, water and aqueous H2O2 conditions Y Wang, Y Zhu, D Zhao, D Bian Applied Surface Science 464, 229-235, 2019 | 25 | 2019 |
| A mathematical model for material removal and chemical–mechanical synergy in chemical–mechanical polishing at molecular scale J Bai, YW Zhao, YG Wang Applied surface science 253 (20), 8489-8494, 2007 | 25 | 2007 |
| Chemical mechanical planarization from macro-scale to molecular-scale Y Wang, YW Zhao, X Chen Materials and Manufacturing Processes 27 (6), 641-649, 2012 | 24 | 2012 |
| A molecular-scale analytic model to evaluate material removal rate in chemical mechanical planarization considering the abrasive shape Y Wang, Y Chen, F Qi, Z Xing, W Liu Microelectronic Engineering 134, 54-59, 2015 | 20 | 2015 |
| Chemical mechanical planarization of silicon wafers at natural pH for green manufacturing YG Wang, Y Chen, YW Zhao International Journal of Precision Engineering and Manufacturing 16, 2049-2054, 2015 | 18 | 2015 |
| Deformation mechanism of CrN/nitriding coated steel in wear and nano-scratch experiments under heavy loading conditions Y Wang, Y Chen, D Zhao, X Lu, W Liu, F Qi, Y Chen Applied Surface Science 447, 100-106, 2018 | 17 | 2018 |
| Research on the molecular scale material removal mechanism in chemical mechanical polishing YG Wang, YW Zhao Chinese Science Bulletin 53 (13), 2084-2089, 2008 | 17 | 2008 |
