Mutual coupling reduction using micromachined complementary meander-line slots for a patch array antenna S Hwangbo, HY Yang, YK Yoon IEEE Antennas and Wireless Propagation Letters 16, 1667-1670, 2017 | 95 | 2017 |
Cu/Co multilayer-based high signal integrity and low RF loss conductors for 5G/millimeter wave applications S Hwangbo, A Rahimi, YK Yoon IEEE Transactions on Microwave Theory and Techniques 66 (8), 3773-3780, 2018 | 26 | 2018 |
Airbrushing and surface modification for fabricating flexible electronics on polydimethylsiloxane K Sondhi, S Hwangbo, YK Yoon, T Nishida, ZH Fan Journal of Micromechanics and Microengineering 28 (12), 125014, 2018 | 23 | 2018 |
Directional through glass via (TGV) antennas for wireless point-to-point interconnects in 3D integration and packaging S Hwangbo, SP Fang, H An, YK Yoon, AB Shorey, AM Kazmi 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 260-265, 2017 | 15 | 2017 |
Through Glass Via (TGV) disc loaded monopole antennas for millimeter-wave wireless interposer communication S Hwangbo, A Rahimi, C Kim, HY Yang, YK Yoon 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 999-1004, 2015 | 15 | 2015 |
Millimeter-wave wireless intra-/inter chip communications in 3D integrated circuits using through glass via (TGV) disc-loaded patch antennas S Hwangbo, AB Shorey, YK Yoon 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2507-2512, 2016 | 13 | 2016 |
Glass interposer integrated dual-band millimeter wave TGV antenna for inter-/intra chip and board communications S Hwangbo, YK Yoon, A Shorey 2016 IEEE International Symposium on Antennas and Propagation (APSURSI …, 2016 | 12 | 2016 |
Millimeter-wave wireless chip-to-chip (c2c) communications in 3d system-in-packaging (sip) using compact through glass via (tgv)-integrated antennas S Hwangbo, YK Yoon, AB Shorey 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2074-2079, 2018 | 10 | 2018 |
Integrated compact planar inverted-F antenna (PIFA) with a shorting via wall for millimeter-wave wireless chip-to-chip (C2C) communications in 3D-SiP S Hwangbo, R Bowrothu, H Kim, YK Yoon 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 983-988, 2019 | 9 | 2019 |
Reliability of passive printed dipole antennas under extreme environments J Amontree, K Sondhi, S Hwangbo, SGR Avuthu, YK Yoon, T Nishida, ... 2018 6th IEEE International Conference on Wireless for Space and Extreme …, 2018 | 9 | 2018 |
Airbrushed dipole RF strain sensor antenna on a stretchable polyurethane substrate K Sondhi, J Amontree, S Hwangbo, SGR Avuthu, YK Yoon, ZH Fan, ... 2018 IEEE SENSORS, 1-4, 2018 | 9 | 2018 |
Investigation of ferromagnetic resonance shift in screen-printed barium ferrite/samarium cobalt composites C Velez, S Hwangbo, ST Chyczewski, J Ewing, R Bowrothu, CS Smith, ... IEEE Transactions on Microwave Theory and Techniques 67 (8), 3230-3236, 2019 | 8 | 2019 |
28GHz through glass via (TGV) based band pass filter using through fused silica via (TFV) technology R Bowrothu, S Hwangbo, T Schumann, YK Yoon 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 695-699, 2019 | 8 | 2019 |
Cu/Co metaconductor based high signal integrity transmission lines for millimeter wave applications S Hwangbo, A Rahimi, YK Yoon 2017 IEEE MTT-S International Microwave Symposium (IMS), 707-710, 2017 | 8 | 2017 |
A study on electric power monitoring system per appliance SW Park, JS Kim, SJ Lim, SH HwangBo, JI Son, IY Lee, BH Wang Journal of The Korean Institute of Intelligent Systems 20 (5), 638-644, 2010 | 8 | 2010 |
Self-powered wireless ocean monitoring systems S Hwangbo, JH Jeon, SJ Park SENSORCOMM 2012: The Sixth International Conference on Sensor Technologies …, 2012 | 7 | 2012 |
High-radiation efficiency in array antennas using CU/Co metaconductors R Bowrothu, HI Kim, S Hwangbo, YK Yoon IEEE Transactions on Antennas and Propagation 69 (11), 7993-7998, 2021 | 6 | 2021 |
기기별 전력 모니터링 시스템 개발에 관한 연구 박성욱, 김종식, 임수진, 황보세희, 손준익, 이인용, 왕보현 한국지능시스템학회 논문지 20 (5), 638-644, 2010 | 5 | 2010 |
Fractal-rectangular reactive impedance surface for antenna miniaturization YK Yoon, S Hwangbo, HY Yang US Patent 11,133,601, 2021 | 4 | 2021 |
Highly Compact, Multiband Composite-Right/Left-Handed (CRLH) Transmission Line Based Stub for GPS Applications HI Kim, S Hwangbo, R Bowrothu, YK Yoon 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2085-2090, 2019 | 3 | 2019 |