| Myosin XI-i links the nuclear membrane to the cytoskeleton to control nuclear movement and shape in Arabidopsis K Tamura, K Iwabuchi, Y Fukao, M Kondo, K Okamoto, H Ueda, ... Current Biology 23 (18), 1776-1781, 2013 | 209 | 2013 |
| Regulation of organ straightening and plant posture by an actin–myosin XI cytoskeleton K Okamoto, H Ueda, T Shimada, K Tamura, T Kato, M Tasaka, MT Morita, ... Nature plants 1 (4), 1-7, 2015 | 74 | 2015 |
| The control of grain boundary segregation and segregation-induced brittleness in iron by the application of a magnetic field S Tsurekawa, K Okamoto, K Kawahara, T Watanabe Journal of materials science 40, 895-901, 2005 | 39 | 2005 |
| Electronic package for millimeter wave semiconductor dies D Elad, N Kaminski, K Okamoto, E Shumaker, K Toriyama US Patent 9,219,041, 2015 | 32 | 2015 |
| Regulation of cell differentiation in slime mold development I Takeuchi, K Okamoto, M Tasaka, S Takemoto Bot. Mag. Tokyo Special Issue 1, 47-60, 1978 | 30 | 1978 |
| An ABC transporter B family protein, ABCB19, is required for cytoplasmic streaming and gravitropism of the inflorescence stems K Okamoto, H Ueda, T Shimada, K Tamura, Y Koumoto, M Tasaka, ... Plant signaling & behavior 11 (3), e1010947, 2016 | 28 | 2016 |
| High frequency transition matching in an electronic package for millimeter wave semiconductor dies E Danny, K Noam, O Keishi, S Evgeny, T Kazushige US Patent 8,912,634, 2014 | 27 | 2014 |
| Micro structure observation and reliability behavior of peripheral flip chip interconnections with solder-capped Cu pillar bumps Y Orii, K Toriyama, S Kohara, H Noma, K Okamoto, D Toyoshima, ... Transactions of The Japan Institute of Electronics Packaging 4 (1), 73-86, 2011 | 27 | 2011 |
| Through silicon via process for effective multi-wafer integration A Horibe, K Sueoka, T Aoki, K Toriyama, K Okamoto, S Kohara, H Mori, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1808-1812, 2015 | 22 | 2015 |
| Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump Y Orii, K Toriyama, S Kohara, H Noma, K Okamoto, D Toyoshima, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 340-345, 2011 | 18 | 2011 |
| No clean flux technology for large die flip chip packages A Horibe, KW Lee, K Okamoto, H Mori, Y Orii, Y Nishizako, O Suzuki, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 688-693, 2013 | 14 | 2013 |
| Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide H Noma, K Okamoto, M Tokunari, K Toriyama, Y Tsukada US Patent 9,354,408, 2016 | 12 | 2016 |
| Membrane fluidity in Ehrlich ascites tumor cells treated with adriamycin. M Sugiyama, T Sakanashi, K Okamoto, M Chinami, T Hidaka, R Ogura Biotechnology and Applied Biochemistry 8 (2-3), 217-221, 1986 | 12 | 1986 |
| High-density interconnecting adhesive tape A Horibe, H Mori, K Okamoto US Patent 10,529,665, 2020 | 10 | 2020 |
| Effects of low CTE materials on thermal deformation of organic substrates in flip chip package application H Mori, S Kohara, K Okamoto, H Noma, K Toriyama International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 10 | 2015 |
| Methods for constructing a combustion chamber access door and associated apparatus SH McCall US Patent 6,554,610, 2003 | 10 | 2003 |
| HAST failure investigation on ultra-high density lines for 2.1 D packages H Noma, K Okamoto, K Toriyama, H Mori 2015 International Conference on Electronics Packaging and iMAPS All Asia …, 2015 | 9 | 2015 |
| Integrated circuit chip incorporating embedded thermal radiators for localized, on-demand, heating and a system and method for designing such an integrated circuit chip RS Graf, K Okamoto, F Pakbaz, JR Smith, ST Ventrone US Patent 8,756,549, 2014 | 9 | 2014 |
| Effect of preformed Cu-Sn IMC layer on electromigration reliability of solder capped Cu pillar bump interconnection on an organic substrate Y Orii, K Toriyama, S Kohara, H Noma, K Okamoto, K Uenishi 2012 2nd IEEE CPMT Symposium Japan, 1-4, 2012 | 8 | 2012 |
| High-density interconnecting adhesive tape A Horibe, H Mori, K Okamoto US Patent 10,622,311, 2020 | 7 | 2020 |
