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Junichiro Kadomoto
Junichiro Kadomoto
Other names門本 淳一郎
Assistant Professor, University of Tokyo
Verified email at mtl.t.u-tokyo.ac.jp
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Cited by
Year
QUEST: A 7.49 TOPS multi-purpose log-quantized DNN inference engine stacked on 96MB 3D SRAM using inductive-coupling technology in 40nm CMOS
K Ueyoshi, K Ando, K Hirose, S Takamaeda-Yamazaki, J Kadomoto, ...
2018 IEEE International Solid-State Circuits Conference-(ISSCC), 216-218, 2018
1002018
An open source FPGA-optimized out-of-order RISC-V soft processor
S Mashimo, A Fujita, R Matsuo, S Akaki, A Fukuda, T Koizumi, ...
2019 International Conference on Field-Programmable Technology (ICFPT), 63-71, 2019
352019
A sensing technique for data glove using conductive fiber
R Takada, J Kadomoto, B Shizuki
Extended Abstracts of the 2019 CHI Conference on Human Factors in Computing …, 2019
152019
Analytical thruchip inductive coupling channel design optimization
LC Hsu, J Kadomoto, S Hasegawa, A Kosuge, Y Take, T Kuroda
2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC), 731-736, 2016
132016
10.1 A 6Gb/s 6pJ/b 5mm-distance non-contact interface for modular smartphones using two-fold transmission-line coupler and EMC-qualified pulse transceiver
A Kosuge, S Ishizuka, J Kadomoto, T Kuroda
2015 IEEE International Solid-State Circuits Conference-(ISSCC) Digest of …, 2015
122015
An inductive-coupling bus with collision detection scheme using magnetic field variation for 3-D network-on-chips
J Kadomoto, T Miyata, H Amano, T Kuroda
2016 IEEE Asian Solid-State Circuits Conference (A-SSCC), 41-44, 2016
92016
A 1 Tb/s/mm2inductive-coupling side-by-side chip link
S Hasegawa, J Kadomoto, A Kosuge, T Kuroda
ESSCIRC Conference 2016: 42nd European Solid-State Circuits Conference, 469-472, 2016
82016
A 6 Gb/s 6 pJ/b 5 mm-distance non-contact interface for modular smartphones using two-fold transmission line coupler and high EMC tolerant pulse transceiver
A Kosuge, J Kadomoto, T Kuroda
IEEE Journal of Solid-State Circuits 51 (6), 1446-1456, 2016
82016
Toward Wirelessly Cooperated Shape-Changing Computing Particles
J Kadomoto, T Sasatani, K Narumi, N Usami, H Irie, S Sakai, Y Kawahara
IEEE Pervasive Computing 20 (3), 9-17, 2021
62021
Design of shape-changeable chiplet-based computers using an inductively coupled wireless bus interface
J Kadomoto, H Irie, S Sakai
2020 IEEE 38th International Conference on Computer Design (ICCD), 589-596, 2020
62020
A high-performance out-of-order soft processor without register renaming
S Mitsuno, J Kadomoto, T Koizumi, R Shioya, H Irie, S Sakai
2020 30th International Conference on Field-Programmable Logic and …, 2020
62020
Vertical packet switching elevator network using inductive coupling ThruChip interface
A Nomura, H Matsutani, T Kuroda, J Kadomoto, Y Matsushita, H Amano
2016 Fourth International Symposium on Computing and Networking (CANDAR …, 2016
62016
Compiling and Optimizing Real-world Programs for STRAIGHT ISA
T Koizumi, S Sugita, R Shioya, J Kadomoto, H Irie, S Sakai
2021 IEEE 39th International Conference on Computer Design (ICCD), 400-408, 2021
52021
Wixi: An inter-chip wireless bus interface for shape-changeable chiplet-based computers
J Kadomoto, H Irie, S Sakai
2019 IEEE 37th International Conference on Computer Design (ICCD), 100-108, 2019
52019
An area-efficient out-of-order soft-core processor without register renaming
J Kadomoto, T Koizumi, A Fukuda, R Matsuo, S Mashimo, A Fujita, ...
2018 International Conference on Field-Programmable Technology (FPT), 374-377, 2018
52018
Escalator network for a 3D chip stack with inductive coupling ThruChip Interface
A Nomura, Y Matsushita, J Kadomoto, H Matsutani, T Kuroda, H Amano
International Journal of Networking and Computing 8 (1), 124-139, 2018
52018
A study of physical design guidelines in thruchip inductive coupling channel
LC Hsu, J Kadomoto, S Hasegawa, A Kosuge, Y Take, T Kuroda
IEICE Transactions on Fundamentals of Electronics, Communications and …, 2015
42015
Multiport Register File Design for High-Performance Embedded Cores
J Kadomoto, H Irie, S Sakai
2021 IEEE 14th International Symposium on Embedded Multicore/Many-core …, 2021
32021
An Inductively Coupled Wireless Bus for Chiplet-Based Systems
J Kadomoto, S Mitsuno, H Irie, S Sakai
2020 25th Asia and South Pacific Design Automation Conference (ASP-DAC), 9-10, 2020
22020
Analysis and evaluation of electromagnetic interference between ThruChip interface and LC-VCO
J Kadomoto, S Hasegawa, Y Kiuchi, A Kosuge, T Kuroda
IEICE Transactions on Electronics 99 (6), 659-662, 2016
22016
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