Katsuyuki Sakuma
Katsuyuki Sakuma
Research Staff Member, IBM Thomas J. Watson Research Center
確認したメール アドレス: us.ibm.com - ホームページ
タイトル
引用先
引用先
Three-dimensional silicon integration
JU Knickerbocker, PS Andry, B Dang, RR Horton, MJ Interrante, CS Patel, ...
IBM Journal of Research and Development 52 (6), 553-569, 2008
4792008
Future system-on-silicon LSI chips
M Koyanagi, H Kurino, KW Lee, K Sakuma, N Miyakawa, H Itani
IEEE micro 18 (4), 17-22, 1998
3961998
3D silicon integration
JU Knickerbocker, PS Andry, B Dang, RR Horton, CS Patel, RJ Polastre, ...
2008 58th Electronic Components and Technology Conference, 538-543, 2008
2612008
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
K Sakuma, PS Andry, CK Tsang, SL Wright, B Dang, CS Patel, BC Webb, ...
IBM Journal of Research and Development 52 (6), 611-622, 2008
1602008
Intelligent image sensor chip with three dimensional structure
H Kurino, KW Lee, T Nakamura, K Sakuma, KT Park, N Miyakawa, ...
International Electron Devices Meeting 1999. Technical Digest (Cat. No …, 1999
1441999
New three-dimensional wafer bonding technology using the adhesive injection method
T Matsumoto, M Satoh, K Sakuma, H Kurino, N Miyakawa, H Itani, ...
Japanese journal of applied physics 37 (3S), 1217, 1998
1171998
3D chip stacking technology with low-volume lead-free interconnections
K Sakuma, PS Andry, B Dang, J Maria, CK Tsang, C Patel, SL Wright, ...
2007 Proceedings 57th Electronic Components and Technology Conference, 627-632, 2007
842007
Development of three-dimensional integration technology for highly parallel image-processing chip
KW Lee, T Nakamura, K Sakuma, KT Park, H Shimazutsu, N Miyakawa, ...
Japanese Journal of Applied Physics 39 (4S), 2473, 2000
752000
IMC bonding for 3D interconnection
K Sakuma, K Sueoka, S Kohara, K Matsumoto, H Noma, T Aoki, Y Oyama, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
642010
Characterization of stacked die using die-to-wafer integration for high yield and throughput
K Sakuma, PS Andry, CK Tsang, K Sueoka, Y Oyama, C Patel, B Dang, ...
2008 58th Electronic Components and Technology Conference, 18-23, 2008
522008
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack
Y Ohara, A Noriki, K Sakuma, KW Lee, M Murugesan, J Bea, F Yamada, ...
2009 IEEE International Conference on 3D System Integration, 1-6, 2009
492009
3D chip stacking with C4 technology
B Dang, SL Wright, PS Andry, EJ Sprogis, CK Tsang, MJ Interrante, ...
IBM Journal of Research and Development 52 (6), 599-609, 2008
472008
Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack
K Matsumoto, S Ibaraki, K Sueoka, K Sakuma, H Kikuchi, Y Orii, ...
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management …, 2011
46*2011
Input device for scrolling a computer display
HL Danzyger, JE Herbst, WR Valiunas
US Patent 7,038,664, 2006
44*2006
Liquid crystal display
K Sakuma, Y Sakaguchi
US Patent 6,937,233, 2005
412005
A new wafer scale chip-on-chip (W-CoC) packaging technology using adhesive injection method
H Kurino, KW Lee, K Sakuma, T Nakamura, M Koyanagi
Japanese journal of applied physics 38 (4S), 2406, 1999
301999
Investigations of cooling solutions for three-dimensional (3D) chip stacks
K Matsumoto, S Ibaraki, M Sato, K Sakuma, Y Orii, F Yamada
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management …, 2010
292010
Development of vacuum underfill technology for a 3D chip stack
K Sakuma, S Kohara, K Sueoka, Y Orii, M Kawakami, K Asai, Y Hirayama, ...
Journal of Micromechanics and Microengineering 21 (3), 035024, 2011
272011
Liquid crystal display driver and method thereof
Y Sakaguchi, K Sakuma
US Patent 7,088,324, 2006
26*2006
An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
K Sakuma, K Tunga, B Webb, K Ramachandran, M Interrante, H Liu, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 318-324, 2015
242015
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論文 1–20