| Transformer network-based reinforcement learning method for power distribution network (PDN) optimization of high bandwidth memory (HBM) H Park, M Kim, S Kim, K Kim, H Kim, T Shin, K Son, B Sim, S Kim, S Jeong, ... IEEE Transactions on Microwave Theory and Techniques 70 (11), 4772-4786, 2022 | 19 | 2022 |
| Sequential policy network-based optimal passive equalizer design for an arbitrary channel of high bandwidth memory using advantage actor critic S Choi, M Kim, H Park, K Son, S Kim, J Kim, J Park, H Kim, T Shin, K Kim, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 6 | 2021 |
| Deep reinforcement learning framework for optimal decoupling capacitor placement on general PDN with an arbitrary probing port H Kim, H Park, M Kim, S Choi, J Kim, J Park, S Kim, S Kim, J Kim 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 6 | 2021 |
| Rl4co: an extensive reinforcement learning for combinatorial optimization benchmark F Berto, C Hua, J Park, M Kim, H Kim, J Son, H Kim, J Kim, J Park arXiv preprint arXiv:2306.17100, 2023 | 5 | 2023 |
| Deep reinforcement learning-based pin assignment optimization of BGA packages considering signal integrity with graph representation J Park, M Kim, S Kim, K Son, T Shin, H Park, J Kim, S Choi, H Kim, K Kim, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 5 | 2021 |
| Devformer: A symmetric transformer for context-aware device placement H Kim, M Kim, F Berto, J Kim, J Park International Conference on Machine Learning, 16541-16566, 2023 | 4 | 2023 |
| PAM-4 based PCIe 6.0 channel design optimization method using Bayesian optimization J Kim, H Park, M Kim, S Kim, S Choi, K Son, J Park, H Kim, J Song, Y Ku, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 4 | 2021 |
| Deterministic policy gradient-based reinforcement learning for DDR5 memory signaling architecture optimization considering signal integrity D Lho, H Park, K Kim, S Kim, B Sim, K Son, K Son, J Kim, S Choi, J Park, ... 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging …, 2022 | 3 | 2022 |
| Signal integrity design and analysis of a spiral through-silicon via (TSV) array channel for high bandwidth memory (HBM) S Kim, T Shin, H Park, D Lho, K Son, K Kim, J Park, S Choi, J Kim, H Kim, ... 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021 | 3 | 2021 |
| Imitation learning for simultaneous escape routing M Kim, H Park, K Son, S Kim, H Kim, J Kim, J Song, Y Ku, J Park, J Kim 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 3 | 2021 |
| Deep Reinforcement Learning-based Optimal and Fast Hybrid Equalizer Design Method for High Bandwidth Memory (HBM) Module S Choi, K Son, H Park, S Kim, B Sim, J Kim, J Park, M Kim, H Kim, J Song, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 2 | 2023 |
| Collaborative symmetricity exploitation for offline learning of hardware design solver H Kim, M Kim, J Kim, J Park | 2 | 2022 |
| Collaborative distillation meta learning for simulation intensive hardware design H Kim, M Kim, J Kim, J Park arXiv preprint arXiv:2205.13225, 2022 | 2 | 2022 |
| Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module H Kim, H Kim, J Park, K Son, H Park, T Shin, K Kim, J Yoon, J Lee, J Hong, ... 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2022 | 1 | 2022 |
| Imitation Learning with Bayesian Exploration (IL-BE) for Signal Integrity (SI) of PAM-4 based High-speed Serial Link: PCIe 6.0 J Kim, J Kim, H Park, J Yoon, S Choi, J Park, HY Kim, K Son, SG Kim, ... DesignCon 2022, 2022 | 1 | 2022 |
| Deep Reinforcement Learning-based Channel-flexible Equalization Scheme: An Application to High Bandwidth Memory S Choi, J Kim, H Park, H Kim, J Park, K Son, SG Kim, K Kim, D Lho, ... DesignCon 2022, 2022 | 1 | 2022 |
| Neural Language Model Enables Extremely Fast and Robust Routing on Interposer M Kim, J Kim, H Park, S Choi, H Kim, SG Kim, K Son, K Kim, D Lho Designcon 2021, 2021 | 1 | 2021 |
| Design and analysis of on-package inductor of an integrated voltage regulator for high-Q factor and EMI shielding in active interposer based 2.5 D/3D ICs S Kim, S Jeong, B Sim, S Lee, H Park, H Kim, J Kim 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 498-503, 2021 | 1 | 2021 |
| Bayesian Exploration Imitation Learning-Based Contextual via Design Optimization Method of PAM-4-Based High-Speed Serial Link J Kim, M Kim, H Kim, H Park, S Choi, J Park, B Sim, K Son, S Kim, J Song, ... IEEE Transactions on Electromagnetic Compatibility, 2023 | | 2023 |
| Power Distribution Network Impedance Analysis considering Thermal Distribution K Son, D Lho, K Kim, S Choi, H Kim, H Park, B Sim, H Kim, T Shin, J Kim 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2022 | | 2022 |
Hyunwook ParkMissouri University of Science and Technology (MST)Verified email at mst.edu
