| Performance and reliability of MEMS gyroscopes at high temperatures C Patel, P McCluskey, D Lemus 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 39 | 2010 |
| Modeling and simulation of the MEMS vibratory gyroscope C Patel, P McCluskey 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 23 | 2012 |
| Temperature effects on the performance and reliability of MEMS Gyroscope Sensors C Patel, A Jones, J Davis, P McCluskey, D Lemus International Electronic Packaging Technical Conference and Exhibition 43598 …, 2009 | 21 | 2009 |
| Advancements in silver wire bonding S Manoharan, C Patel, P McCluskey International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 18 | 2017 |
| Failure mechanisms in encapsulated copper wire-bonded devices MGP Subramani Manoharan, Gopal KrishnanRamaswami, F. Patrick McCluskey ... Physical and Failure Analysis of Integrated Circuits (IPFA), 2016 IEEE 23rd …, 2016 | 18* | 2016 |
| Aging characteristics of green mold compound for use in encapsulation of microelectronic devices S Manoharan, C Patel, S Dunford, C Morillo, P McCluskey 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1768-1773, 2018 | 15 | 2018 |
| Mechanism of wire bond shear testing S Manoharan, C Patel, S Hunter, P McCluskey Microelectronics Reliability 88, 738-744, 2018 | 13 | 2018 |
| Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment S Manoharan, C Patel, P McCluskey, M Pecht Microelectronics Reliability 84, 197-207, 2018 | 11 | 2018 |
| Decapsulation of plastic encapsulated microelectronics with copper wire bonds S Manoharan, C Patel, P McCluskey Additional Papers and Presentations 2016 (HiTEC), 000092-000096, 2016 | 10 | 2016 |
| Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA) S Manoharan, C Patel, S Dunford, J Beshears, P McCluskey Microelectronics Reliability 99, 137-151, 2019 | 9 | 2019 |
| Performance degradation of the MEMS vibratory gyroscope in harsh environments C Patel, P McCluskey ASME International Mechanical Engineering Congress and Exposition 54976, 511-515, 2011 | 8 | 2011 |
| Effects of bond pad thickness on shear strength of copper wire bonds S Manoharan, C Patel, S Hunter, P McCluskey Additional Papers and Presentations 2017 (HiTEN), 000068-000073, 2017 | 7 | 2017 |
| Performance of MEMS Vibratory Gyroscope under Harsh Environments C Patel, P McCluskey IMAPS-DPC 2012 (DPC), 000633-000654, 2012 | 7 | 2012 |
| Mechanics of Copper Wire Bond Failure due to Thermal Fatigue S Manoharan, NMJ Li, C Patel, S Hunter, P McCluskey Electronics Packaging Technology Conference (EPTC), 2018 | 6 | 2018 |
| Combined Temperature and Humidity Effects on MEMS Vibratory Gyroscope Sensor C Patel, P McCluskey International Electronic Packaging Technical Conference and Exhibition 44618 …, 2011 | 6 | 2011 |
| Influence of initial shear strength on time-to-failure of copper (Cu) wire bonds in thermal aging condition S Manoharan, C Patel, S Hunter, P McCluskey Additional Papers and Presentations 2018 (HiTEC), 000032-000038, 2018 | 5 | 2018 |
| Performance Assessment of MEMS Gyroscope and Shock Durability Evaluation of SAC305-X Solders for High Temperature Applications C Patel University of Maryland, College Park, 2014 | 5 | 2014 |
| A characterization of the performance of mems vibratory gyroscope in temperature and humidity environments C Patel, P McCluskey Transaction on Control and Mechanical Systems 1 (6), 7, 2012 | 5 | 2012 |
| Temperature and Humidity Effects on MEMS Vibratory Gyroscopes C Patel, FP McCluskey, D Lemus International Conference and Exhibition on Device Packaging, 2011 | 4 | 2011 |
| Performance and Reliability of MEMS Gyroscopes and Packaging at High Temperatures FP McCluskey, C Patel, D Lemus International Conference on High Temperature Electronics (HiTEC), 2010 | 4 | 2010 |
Patrick McCluskeyProfessor, University of Maryland, College Park確認したメール アドレス: umd.edu
