| Deep reinforcement learning-based optimal decoupling capacitor design method for silicon interposer-based 2.5-D/3-D ICs H Park, J Park, S Kim, K Cho, D Lho, S Jeong, S Park, G Park, B Sim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 58 | 2020 |
| Signal integrity design and analysis of differential high-speed serial links in silicon interposer with through-silicon via K Cho, Y Kim, H Lee, J Song, J Park, S Lee, S Kim, G Park, K Son, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018 | 30 | 2018 |
| Reinforcement learning-based optimal on-board decoupling capacitor design method H Park, J Park, S Kim, D Lho, S Park, G Park, K Cho, J Kim 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 25 | 2018 |
| Signal integrity and computing performance analysis of a processing-in-memory of high bandwidth memory (PIM-HBM) scheme S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 14 | 2021 |
| Wideband power/ground noise suppression in low-loss glass interposers using a double-sided electromagnetic bandgap structure Y Kim, G Park, K Cho, PM Raj, RR Tummala, J Kim IEEE Transactions on Microwave Theory and Techniques 68 (12), 5055-5064, 2020 | 14 | 2020 |
| Processing-in-memory in high bandwidth memory (PIM-HBM) architecture with energy-efficient and low latency channels for high bandwidth system S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 14 | 2019 |
| Polynomial model-based eye diagram estimation methods for LFSR-based bit streams in PRBS test and scrambling J Park, S Park, Y Kim, G Park, H Park, D Lho, K Cho, S Lee, DH Kim, ... IEEE Transactions on Electromagnetic Compatibility 61 (6), 1867-1875, 2019 | 14 | 2019 |
| Signal integrity design and analysis of 3-D X-point memory considering crosstalk and IR drop for higher performance computing K Son, K Cho, S Kim, S Park, DH Jung, J Park, G Park, S Kim, T Shin, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 13 | 2020 |
| Measurement and analysis of through glass via noise coupling and shielding structures in a glass interposer G Park, Y Kim, K Cho, J Park, I Hwang, J Kim, K Son, H Park, ... IEEE Transactions on Electromagnetic Compatibility 63 (5), 1562-1573, 2021 | 12 | 2021 |
| Bayesian optimization of high-speed channel for signal integrity analysis D Lho, J Park, H Park, S Park, S Kim, H Kang, S Kim, G Park, K Son, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 12 | 2019 |
| Modeling and signal integrity analysis of 3D XPoint memory cells and interconnections with memory size variations during read operation K Son, K Cho, S Kim, G Park, K Song, J Kim 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018 | 12 | 2018 |
| Miniaturized and high-performance RF packages with ultra-thin glass substrates MS Kim, MR Pulugurtha, Y Kim, G Park, K Cho, V Smet, V Sundaram, ... Microelectronics journal 77, 66-72, 2018 | 12 | 2018 |
| A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation With N-Level (PAM-N) on Stacked Through-Silicon Vias J Park, DH Jung, B Kim, S Choi, Y Kim, S Park, G Park, K Cho, S Lee, ... IEEE Transactions on Electromagnetic Compatibility 61 (4), 1198-1206, 2018 | 11 | 2018 |
| Reinforcement-learning-based signal integrity optimization and analysis of a scalable 3-d x-point array structure K Son, M Kim, H Park, D Lho, K Son, K Kim, S Lee, S Jeong, S Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2021 | 9 | 2021 |
| Policy gradient reinforcement learning-based optimal decoupling capacitor design method for 2.5-d/3-d ics using transformer network H Park, M Kim, S Kim, S Jeong, S Kim, H Kang, K Kim, K Son, G Park, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 9 | 2020 |
| Reinforcement learning-based auto-router considering signal integrity M Kim, H Park, S Kim, K Son, S Kim, K Son, S Choi, G Park, J Kim 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 9 | 2020 |
| Glass-interposer electromagnetic bandgap structure with defected ground plane for broadband suppression of power/ground noise coupling Y Kim, J Cho, K Cho, J Park, S Kim, DH Kim, G Park, S Sitaraman, PM Raj, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017 | 9 | 2017 |
| Modeling and analysis of system-level power supply noise induced jitter (PSIJ) for 4 Gbps high bandwidth memory (HBM) I/O interface T Shin, H Park, K Kim, S Kim, K Son, K Son, G Park, J Park, S Choi, J Kim 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021 | 7 | 2021 |
| Design and analysis of thermal transmission line based embedded cooling structures for high bandwidth memory module and 2.5 D/3D ICs K Son, S Kim, S Park, H Park, K Kim, T Shin, M Kim, K Son, G Park, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 7 | 2020 |
| Impact of on-chip interconnection in a large-scale memristor crossbar array for neural network accelerator and neuromorphic chip T Shin, K Son, S Kim, K Cho, S Park, S Kim, G Park, B Sim, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 7 | 2019 |
