| Deep reinforcement learning-based optimal decoupling capacitor design method for silicon interposer-based 2.5-D/3-D ICs H Park, J Park, S Kim, K Cho, D Lho, S Jeong, S Park, G Park, B Sim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 58 | 2020 |
| Reinforcement learning-based optimal on-board decoupling capacitor design method H Park, J Park, S Kim, D Lho, S Park, G Park, K Cho, J Kim 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 25 | 2018 |
| Active silicon interposer design for interposer-level wireless power transfer technology for high-density 2.5-D and 3-D ICs J Song, S Park, S Kim, JJ Kim, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (8 …, 2016 | 21 | 2016 |
| A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive … B Sim, S Jeong, Y Kim, S Park, S Lee, S Hong, J Song, H Kim, H Kang, ... IEEE Transactions on Electromagnetic Compatibility 63 (3), 935-946, 2020 | 20 | 2020 |
| Signal integrity and computing performance analysis of a processing-in-memory of high bandwidth memory (PIM-HBM) scheme S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 14 | 2021 |
| Polynomial model-based eye diagram estimation methods for LFSR-based bit streams in PRBS test and scrambling J Park, S Park, Y Kim, G Park, H Park, D Lho, K Cho, S Lee, DH Kim, ... IEEE Transactions on Electromagnetic Compatibility 61 (6), 1867-1875, 2019 | 14 | 2019 |
| Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 14 | 2019 |
| Signal Integrity Design and Analysis of 3-D X-Point Memory Considering Crosstalk and IR Drop for Higher Performance Computing K Son, K Cho, S Kim, S Park, DH Jung, J Park, G Park, S Kim, T Shin, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 13 | 2020 |
| Channel characteristic-based deep neural network models for accurate eye diagram estimation in high bandwidth memory (HBM) silicon interposer D Lho, H Park, S Park, S Kim, H Kang, B Sim, S Kim, J Park, K Cho, ... IEEE Transactions on Electromagnetic Compatibility 64 (1), 196-208, 2021 | 12 | 2021 |
| Bayesian Optimization of High-Speed Channel for Signal Integrity Analysis SP Daehwan Lho, Junyong Park, Hyunwook Park, S Kim, H Kang, S Kim, ... 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 12 | 2019 |
| High-frequency modeling and signal integrity analysis of a silicone rubber socket for high-performance package H Kim, JJ Kim, J Park, S Park, S Choi, B Bae, DH Ha, M Bae, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (8 …, 2017 | 12 | 2017 |
| A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation With N-Level (PAM-N) on Stacked Through-Silicon Vias J Park, DH Jung, B Kim, S Choi, Y Kim, S Park, G Park, K Cho, S Lee, ... IEEE Transactions on Electromagnetic Compatibility 61 (4), 1198-1206, 2018 | 11 | 2018 |
| Eye-Width and Eye-Height Estimation Method Based on Artificial Neural Network (ANN) for USB 3.0 D Lho, J Park, H Park, H Kang, S Park, J Kim 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 10 | 2018 |
| Reinforcement-learning-based signal integrity optimization and analysis of a scalable 3-d x-point array structure K Son, M Kim, H Park, D Lho, K Son, K Kim, S Lee, S Jeong, S Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2021 | 9 | 2021 |
| Design and analysis of thermal transmission line based embedded cooling structures for high bandwidth memory module and 2.5 D/3D ICs K Son, S Kim, S Park, H Park, K Kim, T Shin, M Kim, K Son, G Park, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 7 | 2020 |
| Impact of On-Chip Interconnection in a Large-Scale Memristor Crossbar Array for Neural Network Accelerator and Neuromorphic Chip JK Taein Shin, Kyungjune Son, Seongguk Kim, Kyungjun Cho, Shinyoung Park ... 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 7 | 2019 |
| Thermal and signal integrity co-design and verification of embedded cooling structure with thermal transmission line for high bandwidth memory module K Son, S Kim, H Park, T Shin, K Kim, M Kim, B Sim, S Kim, G Park, S Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 6 | 2022 |
| Signal integrity modeling and analysis of large-scale memristor crossbar array in a high-speed neuromorphic system for deep neural network T Shin, S Park, S Kim, S Kim, K Son, H Park, D Lho, K Cho, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 6 | 2021 |
| A novel through mold plate (TMP) for signal and thermal integrity improvement of high bandwidth memory (HBM) K Son, S Kim, H Park, S Kim, K Kim, S Park, B Sim, S Jeong, G Park, J Kim 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and …, 2020 | 5 | 2020 |
| Modeling, measurement, and analysis of audio frequency ground integrity for a TDMA smartphone system S Park, J Song, S Kim, Y Kim, M Lee, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (4 …, 2018 | 5 | 2018 |
