フォロー
Harold Philipsen
Harold Philipsen
その他の名前H.G.G. Philipsen, Henricus Philipsen
Principal Member of Technical Staff at IMEC
確認したメール アドレス: imec.be - ホームページ
タイトル
引用先
引用先
Copper plating for 3D interconnects
A Radisic, O Lühn, HGG Philipsen, Z El-Mekki, M Honore, S Rodet, ...
Microelectronic Engineering 88 (5), 701-704, 2011
982011
Anisotropy in the wet-etching of semiconductors
JJ Kelly, HGG Philipsen
Current opinion in solid state and materials science 9 (1-2), 84-90, 2005
722005
Scalable through silicon via with polymer deep trench isolation for 3D wafer level packaging
DS Tezcan, F Duval, H Philipsen, O Luhn, P Soussan, B Swinnen
59th Electronic Components and Technology Conference, 1159-1164, 2009
712009
Large area copper plated silicon solar cell exceeding 19.5 % efficiency
L Tous, R Russell, J Das, R Labie, M Ngamo, J Horzel, H Philipsen, ...
Energy Procedia 21, 58-65, 2012
702012
Impact of post-plating anneal and through-silicon via dimensions on Cu pumping
J De Messemaeker, OV Pedreira, B Vandevelde, H Philipsen, I De Wolf, ...
2013 IEEE 63rd Electronic Components and Technology Conference, 586-591, 2013
632013
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
F Inoue, H Philipsen, A Radisic, S Armini, Y Civale, P Leunissen, ...
Electrochimica Acta 100, 203-211, 2013
582013
Implementation of an industry compliant, 5 × 50 μm, via-middle TSV technology on 300 mm wafers
A Redolfi, D Velenis, S Thangaraju, P Nolmans, P Jaenen, M Kostermans, ...
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, 1384 …, 2011
582011
A simple copper metallisation process for high cell efficiencies and reliable modules
R Russell, L Tous, H Philipsen, J Horzel, E Cornagliotti, M Ngamo Toko, ...
27th European Photovoltaic Solar Energy Conference and Exhibition - EUPVSEC, 2012
572012
3-D wafer-level packaging die stacking using spin-on-dielectric polymer liner through-silicon vias
Y Civale, DS Tezcan, HGG Philipsen, FFC Duval, P Jaenen, Y Travaly, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (6 …, 2011
562011
Correlation between Cu microstructure and TSV Cu pumping
J De Messemaeker, OV Pedreira, H Philipsen, E Beyne, I De Wolf, ...
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 613 …, 2014
522014
Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed
S Armini, Z El-Mekki, K Vandersmissen, H Philipsen, S Rodet, M Honore, ...
Journal of the Electrochemical Society 158 (2), H160, 2010
482010
Anisotropy in the anodic oxidation of silicon in KOH solution
HGG Philipsen, JJ Kelly
The Journal of Physical Chemistry B 109 (36), 17245-17253, 2005
432005
High efficiency silver-free heterojunction silicon solar cell
JL Hernandez, K Yoshikawa, A Feltrin, N Menou, N Valckx, E Van Assche, ...
Japanese Journal of Applied Physics 51 (10S), 10NA04, 2012
362012
Electroless copper bath stability monitoring with UV-Vis spectroscopy, pH, and mixed potential measurements
F Inoue, H Philipsen, A Radisic, S Armini, Y Civale, S Shingubara, ...
Journal of The Electrochemical Society 159 (7), D437, 2012
342012
High frequency scanning acoustic microscopy applied to 3D integrated process: void detection in through silicon vias
A Phommahaxay, I De Wolf, P Hoffrogge, S Brand, P Czurratis, ...
2013 IEEE 63rd Electronic Components and Technology Conference, 227-231, 2013
292013
Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-silicon via interconnects
Y Civale, S Armini, H Philipsen, A Redolfi, D Velenis, K Croes, N Heylen, ...
2012 IEEE 62nd electronic components and technology conference, 822-826, 2012
292012
Impact of thinning and through silicon via proximity on high-k/metal gate first CMOS performance
A Mercha, A Redolfi, M Stucchi, N Minas, J Van Olmen, S Thangaraju, ...
2010 Symposium on VLSI Technology, 109-110, 2010
272010
Die stacking using 3D-wafer level packaging copper/polymer through-Si via technology and Cu/Sn interconnect bumping
Y Civale, DS Tezcan, HGG Philipsen, P Jaenen, R Agarwal, F Duval, ...
2009 IEEE International Conference on 3D System Integration, 1-4, 2009
272009
Co-W nanocrystalline electrodeposits as barrier for interconnects
N Tsyntsaru, G Kaziukaitis, C Yang, H Cesiulis, HGG Philipsen, M Lelis, ...
Journal of Solid State Electrochemistry 18, 3057-3064, 2014
232014
Influence of chemical additives on the surface reactivity of Si in KOH solution
HGG Philipsen, JJ Kelly
Electrochimica Acta 54 (13), 3526-3531, 2009
212009
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