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Co-authors
- Linda MeylaniTelkom UniversityVerified email at telkomuniversity.ac.id
- Heroe WijantoTelkom University, School of Electrical Engineering, Telecommunication Engineering DepartmentVerified email at telkomuniversity.ac.id
- Mohammad Sigit ArifiantoInstitut Teknologi BandungVerified email at stei.itb.ac.id
- Achmad RizalTelkom UniversityVerified email at telkomuniversity.ac.id
- Khoirul AnwarThe Univ. Center of Excellence for Advanced Intelligent Comms. (AICOMS), Telkom UniversityVerified email at telkomuniversity.ac.id
- Rina Pudji AstutiTelkom University, School of Electrical EngineeringVerified email at telkomuniversity.ac.id
- Sugondo HadiyosoSchool of Applied Science, Telkom UniversityVerified email at telkomuniversity.ac.id
- Budi HerdianaUniversitas Komputer IndonesiaVerified email at email.unikom.ac.id
- Rita PurnamasariTelkom UniversityVerified email at telkomuniversity.ac.id
- Rizki Ardianto PriramadhiElectrical Engineering, Telkom UniversityVerified email at telkomuniversity.ac.id
- Gelar BudimanLecturer, Telkom UniversityVerified email at telkomuniversity.ac.id
- Fiky Y. SuratmanSchool of Electrical Engineering, Telkom University, IndonesiaVerified email at telkomuniversity.ac.id
- EstanantoTelkom UniversityVerified email at telkomuniversity.ac.id
- Cahyono DwiAKKA EMC GmbHVerified email at akka.eu
- ekki kurniawanTelkom UniversityVerified email at telkomuniversity.ac.id
- Budi SyihabuddinTelkom UniversityVerified email at telkomuniversity.ac.id
- Denny DarlisTelkom UniversityVerified email at telkomuniversity.ac.id
- Efa Maydhona SaputraInstitut Teknologi SumateraVerified email at el.itera.ac.id
- Trio AdionoProfessor in Chip Design, STEI, Institut Teknologi BandungVerified email at stei.itb.ac.id
- Mohamad RamdhaniTelkom UniversityVerified email at telkomuniversity.ac.id