| Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni CE Ho, RY Tsai, YL Lin, CR Kao Journal of Electronic Materials 31, 584-590, 2002 | 382 | 2002 |
| Interfacial reaction issues for lead-free electronic solders KN Subramanian, CE Ho, SC Yang, CR Kao Lead-Free Electronic Solders: A Special Issue of the Journal of Materials …, 2007 | 379 | 2007 |
| Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders WT Chen, CE Ho, CR Kao Journal of materials research 17 (2), 263-266, 2002 | 246 | 2002 |
| Quantitative studies of thin foils in the transmission electron microscope DA Rae PQDT-UK & Ireland, 1982 | 217 | 1982 |
| Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu YW Wang, YW Lin, CT Tu, CR Kao Journal of alloys and compounds 478 (1-2), 121-127, 2009 | 200 | 2009 |
| A study on the reaction between Cu and Sn3. 5Ag solder doped with small amounts of Ni JY Tsai, YC Hu, CM Tsai, CR Kao Journal of Electronic Materials 32, 1203-1208, 2003 | 185 | 2003 |
| In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing YH Lin, YC Hu, CM Tsai, CR Kao, KN Tu Acta materialia 53 (7), 2029-2035, 2005 | 181 | 2005 |
| Electromigration failure in flip chip solder joints due to rapid dissolution of copper YC Hu, YH Lin, CR Kao, KN Tu Journal of materials research 18 (11), 2544-2548, 2003 | 165 | 2003 |
| Effects of limited Cu supply on soldering reactions between SnAgCu and Ni CE Ho, YW Lin, SC Yang, CR Kao, DS Jiang Journal of electronic materials 35, 1017-1024, 2006 | 163 | 2006 |
| Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish CE Ho, R Zheng, GL Luo, AH Lin, CR Kao Journal of electronic materials 29, 1175-1181, 2000 | 158 | 2000 |
| Phase diagrams of Pb-free solders and their related materials systems KN Subramanian, SW Chen, CH Wang, SK Lin, CN Chiu Lead-Free Electronic Solders: A Special Issue of the Journal of Materials …, 2007 | 145 | 2007 |
| Interface reactions between silicon carbide and metals (Ni, Cr, Pd, Zr) K Bhanumurthy, R Schmid-Fetzer Composites Part A: Applied science and manufacturing 32 (3-4), 569-574, 2001 | 141 | 2001 |
| On the composition dependencies of self-diffusion coefficients in B2 intermetallic compounds CR Kao, YA Chang Intermetallics 1 (4), 237-250, 1993 | 138 | 1993 |
| Electromigration issues in lead-free solder joints KN Subramanian, C Chen, SW Liang Lead-Free Electronic Solders: A Special Issue of the Journal of Materials …, 2007 | 134 | 2007 |
| Reactions between Sn–Ag–Cu lead‐free solders and the Au/Ni surface finish in advanced electronic packages LC Shiau, CE Ho, CR Kao Soldering & Surface Mount Technology 14 (3), 25-29, 2002 | 128 | 2002 |
| Controlling the microstructure from the gold-tin reaction JY Tsai, CW Chang, YC Shieh, YC Hu, CR Kao Journal of electronic materials 34, 182-187, 2005 | 125 | 2005 |
| Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect JW Nah, JO Suh, KN Tu, SW Yoon, VS Rao, V Kripesh, F Hua Journal of applied physics 100 (12), 2006 | 123 | 2006 |
| Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations WC Luo, CE Ho, JY Tsai, YL Lin, CR Kao Materials Science and Engineering: A 396 (1-2), 385-391, 2005 | 123 | 2005 |
| Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth YW Wang, CC Chang, CR Kao Journal of Alloys and Compounds 478 (1-2), L1-L4, 2009 | 122 | 2009 |
| Electromigration-induced failure in flip-chip solder joints YH Lin, CM Tsai, YC Hu, YL Lin, CR Kao Journal of electronic materials 34, 27-33, 2005 | 116 | 2005 |
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