| Deep reinforcement learning-based optimal decoupling capacitor design method for silicon interposer-based 2.5-D/3-D ICs H Park, J Park, S Kim, K Cho, D Lho, S Jeong, S Park, G Park, B Sim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 58 | 2020 |
| Transformer network-based reinforcement learning method for power distribution network (PDN) optimization of high bandwidth memory (HBM) H Park, M Kim, S Kim, K Kim, H Kim, T Shin, K Son, B Sim, S Kim, S Jeong, ... IEEE Transactions on Microwave Theory and Techniques 70 (11), 4772-4786, 2022 | 19 | 2022 |
| Signal integrity and computing performance analysis of a processing-in-memory of high bandwidth memory (PIM-HBM) scheme S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 14 | 2021 |
| Processing-in-memory in high bandwidth memory (PIM-HBM) architecture with energy-efficient and low latency channels for high bandwidth system S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 14 | 2019 |
| Signal integrity design and analysis of 3-D X-point memory considering crosstalk and IR drop for higher performance computing K Son, K Cho, S Kim, S Park, DH Jung, J Park, G Park, S Kim, T Shin, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 13 | 2020 |
| Channel characteristic-based deep neural network models for accurate eye diagram estimation in high bandwidth memory (HBM) silicon interposer D Lho, H Park, S Park, S Kim, H Kang, B Sim, S Kim, J Park, K Cho, ... IEEE Transactions on Electromagnetic Compatibility 64 (1), 196-208, 2021 | 12 | 2021 |
| Bayesian optimization of high-speed channel for signal integrity analysis D Lho, J Park, H Park, S Park, S Kim, H Kang, S Kim, G Park, K Son, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 12 | 2019 |
| Policy gradient reinforcement learning-based optimal decoupling capacitor design method for 2.5-d/3-d ics using transformer network H Park, M Kim, S Kim, S Jeong, S Kim, H Kang, K Kim, K Son, G Park, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 9 | 2020 |
| Reinforcement learning-based auto-router considering signal integrity M Kim, H Park, S Kim, K Son, S Kim, K Son, S Choi, G Park, J Kim 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 9 | 2020 |
| Modeling and analysis of system-level power supply noise induced jitter (PSIJ) for 4 Gbps high bandwidth memory (HBM) I/O interface T Shin, H Park, K Kim, S Kim, K Son, K Son, G Park, J Park, S Choi, J Kim 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021 | 7 | 2021 |
| Deep reinforcement learning-based through silicon via (TSV) array design optimization method considering crosstalk K Kim, H Park, D Lho, M Kim, K Son, K Son, S Kim, T Shin, S Choi, J Kim 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 7 | 2020 |
| Impact of on-chip interconnection in a large-scale memristor crossbar array for neural network accelerator and neuromorphic chip T Shin, K Son, S Kim, K Cho, S Park, S Kim, G Park, B Sim, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 7 | 2019 |
| Thermal and signal integrity co-design and verification of embedded cooling structure with thermal transmission line for high bandwidth memory module K Son, S Kim, H Park, T Shin, K Kim, M Kim, B Sim, S Kim, G Park, S Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 6 | 2022 |
| Sequential policy network-based optimal passive equalizer design for an arbitrary channel of high bandwidth memory using advantage actor critic S Choi, M Kim, H Park, K Son, S Kim, J Kim, J Park, H Kim, T Shin, K Kim, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 6 | 2021 |
| Deep reinforcement learning framework for optimal decoupling capacitor placement on general PDN with an arbitrary probing port H Kim, H Park, M Kim, S Choi, J Kim, J Park, S Kim, S Kim, J Kim 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 6 | 2021 |
| Signal integrity modeling and analysis of large-scale memristor crossbar array in a high-speed neuromorphic system for deep neural network T Shin, S Park, S Kim, S Kim, K Son, H Park, D Lho, K Cho, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 6 | 2021 |
| Deep reinforcement learning-based pin assignment optimization of BGA packages considering signal integrity with graph representation J Park, M Kim, S Kim, K Son, T Shin, H Park, J Kim, S Choi, H Kim, K Kim, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 5 | 2021 |
| A novel through mold plate (TMP) for signal and thermal integrity improvement of high bandwidth memory (HBM) K Son, S Kim, H Park, S Kim, K Kim, S Park, B Sim, S Jeong, G Park, J Kim 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and …, 2020 | 5 | 2020 |
| Design and measurement of a 28 GHz glass band pass filter based on glass interposers for 5G applications G Park, K Cho, K Son, H Park, D Lho, S Kim, T Shin, Y Kim, J Kim, ... 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2019 | 5 | 2019 |
| Modeling and Signal Integrity Analysis of Mounting Pad with Layer-cutting to reduce Impedance Mismatch for Dual-In-Line Memory Module (DIMM) H Kim, J Kim, K Song, S Lee, K Kim, S Kim, D Lho, H Kim, M Park, S Ahn 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 4 | 2021 |
