| Frequency response of higher cantilever eigenmodes in bimodal and trimodal tapping mode atomic force microscopy SD Solares, G Chawla Measurement Science and Technology 21 (12), 125502, 2010 | 109 | 2010 |
| Triple-frequency intermittent contact atomic force microscopy characterization: simultaneous topographical, phase, and frequency shift contrast in ambient air SD Solares, G Chawla Journal of Applied Physics 108 (5), 2010 | 94 | 2010 |
| Mapping of conservative and dissipative interactions in bimodal atomic force microscopy using open-loop and phase-locked-loop control of the higher eigenmode G Chawla, SD Solares Applied Physics Letters 99 (7), 2011 | 86 | 2011 |
| Single-cantilever dual-frequency-modulation atomic force microscopy G Chawla, SD Solares Measurement Science and Technology 20 (1), 015501, 2008 | 41 | 2008 |
| Dual frequency modulation with two cantilevers in series: a possible means to rapidly acquire tip–sample interaction force curves with dynamic AFM SD Solares, G Chawla Measurement Science and Technology 19 (5), 055502, 2008 | 30 | 2008 |
| Multi-array bottom-side connector using spring bias G Chawla, DJ Llapitan, JL Smalley, TP Aulakh, V Krithivasan, DT Tran US Patent 9,490,560, 2016 | 16 | 2016 |
| Integrated circuit connectors R Swaminathan, RS Viswanath, S Ganesan, G Chawla, JD Heppner, ... US Patent 9,265,170, 2016 | 16 | 2016 |
| Microelectronic package communication using radio interfaces connected through wiring S Liff, AA Elsherbini, T Kamgaing, SN Oster, G Chawla US Patent 10,852,495, 2020 | 10 | 2020 |
| Reduced capacitance land pad Z Zhang, T Wu, G Chawla, J Lee US Patent 10,433,421, 2019 | 10 | 2019 |
| Connector assembly and method G Chawla, JD Heppner, Z Zhang, DJ Llapitan, V Krithivasan US Patent 8,905,794, 2014 | 10 | 2014 |
| Shielded sockets for microprocessors and fabrication thereof by overmolding and plating JD Heppner, G Chawla US Patent 9,178,328, 2015 | 7 | 2015 |
| Exploration of AFM imaging artifacts occurring at sharp surface features when using short carbon nanotube probes and possible mitigation with real-time force spectroscopy SD Solares, G Chawla | 7 | 2010 |
| Chip socket including a circular contact pattern G Chawla, V Krithivasan, JD Heppner US Patent 8,961,193, 2015 | 6 | 2015 |
| Cable connector DT Tran, J Lee, G Chawla US Patent 9,640,880, 2017 | 5 | 2017 |
| Techniques and configurations associated with a package load assembly G Chawla, JD Heppner, V Krithivasan, M Garcia, KC Liu, R Swaminathan US Patent 9,615,483, 2017 | 5 | 2017 |
| Electronic assemblies with scalable clip-type connectors G Chawla, JD Heppner, JL Smalley, V Krithivasan US Patent 9,325,087, 2016 | 5 | 2016 |
| Socket contact techniques and configurations D Athreya, G Chawla, K Aygun, GP Gordon, SM Canny, JL Smalley, ... US Patent 9,780,510, 2017 | 4 | 2017 |
| Snap connector for socket assembly and associated techniques and configurations Z Zhang, G Chawla, R Swaminathan, K Aygun, L Sun US Patent 9,478,881, 2016 | 4 | 2016 |
| Connector assembly and method G Chawla, JD Heppner, Z Zhang, DJ Llapitan, V Krithivasan US Patent 9,385,457, 2016 | 4 | 2016 |
| Lateral slide pick and place cover for reduced bent pins in LGA sockets V Krithivasan, G Chawla, JD Heppner, JL Smalley US Patent 9,385,444, 2016 | 4 | 2016 |
