| Deep reinforcement learning-based optimal decoupling capacitor design method for silicon interposer-based 2.5-D/3-D ICs H Park, J Park, S Kim, K Cho, D Lho, S Jeong, S Park, G Park, B Sim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 58 | 2020 |
| Signal integrity design and analysis of silicon interposer for GPU-memory channels in high-bandwidth memory interface K Cho, Y Kim, H Lee, H Kim, S Choi, J Song, S Kim, J Park, S Lee, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018 | 50 | 2018 |
| Signal integrity design and analysis of differential high-speed serial links in silicon interposer with through-silicon via K Cho, Y Kim, H Lee, J Song, J Park, S Lee, S Kim, G Park, K Son, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018 | 30 | 2018 |
| Reinforcement learning-based optimal on-board decoupling capacitor design method H Park, J Park, S Kim, D Lho, S Park, G Park, K Cho, J Kim 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 25 | 2018 |
| Design and analysis of power distribution network (PDN) for high bandwidth memory (HBM) interposer in 2.5 D terabyte/s bandwidth graphics module K Cho, Y Kim, H Lee, H Kim, S Choi, S Kim, J Kim 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 407-412, 2016 | 25 | 2016 |
| Fast and accurate power distribution network modeling of a silicon interposer for 2.5-D/3-D ICs with multiarray TSVs K Cho, Y Kim, S Kim, H Park, J Park, S Lee, D Shim, K Lee, S Oh, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019 | 23 | 2019 |
| Highly-effective integrated EMI shields with graphene and nanomagnetic multilayered composites AO Watanabe, S Jeong, S Kim, Y Kim, J Min, D Wong, MR Pulugurtha, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 206-210, 2016 | 22 | 2016 |
| Measurement and analysis of glass interposer power distribution network resonance effects on a high-speed through glass via channel Y Kim, J Cho, JJ Kim, K Kim, K Cho, S Kim, S Sitaraman, V Sundaram, ... IEEE Transactions on Electromagnetic Compatibility 58 (6), 1747-1759, 2016 | 20 | 2016 |
| Transformer network-based reinforcement learning method for power distribution network (PDN) optimization of high bandwidth memory (HBM) H Park, M Kim, S Kim, K Kim, H Kim, T Shin, K Son, B Sim, S Kim, S Jeong, ... IEEE Transactions on Microwave Theory and Techniques 70 (11), 4772-4786, 2022 | 19 | 2022 |
| Design and measurement of a novel on-interposer active power distribution network for efficient simultaneous switching noise suppression in 2.5-D/3-D IC S Kim, Y Kim, K Cho, J Song, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (2 …, 2018 | 18 | 2018 |
| Power distribution network (PDN) design and analysis of a single and double-sided high bandwidth memory (HBM) interposer for 2.5 D terabtye/s bandwidth system K Cho, Y Kim, S Kim, H Lee, S Choi, H Kim, J Kim 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 96-99, 2016 | 16 | 2016 |
| Signal integrity and computing performance analysis of a processing-in-memory of high bandwidth memory (PIM-HBM) scheme S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 14 | 2021 |
| Processing-in-memory in high bandwidth memory (PIM-HBM) architecture with energy-efficient and low latency channels for high bandwidth system S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 14 | 2019 |
| Measurement, simulation and mathematical estimation of magnetic field shielding effectiveness of sputtered shielding materials using spiral coils K Song, S Kim, S Jeong, DH Kim, K Son, J Heo, K Han, Y Jung, H Kim, ... 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018 | 14 | 2018 |
| Signal integrity design and analysis of 3-D X-point memory considering crosstalk and IR drop for higher performance computing K Son, K Cho, S Kim, S Park, DH Jung, J Park, G Park, S Kim, T Shin, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 13 | 2020 |
| Design, simulation and measurement of flexible PCB coils for wearable device wireless power transfer S Jeong, J Song, S Lee, S Hong, B Sim, H Kim, S Kim, J Kim 2018 IEEE Wireless Power Transfer Conference (WPTC), 1-4, 2018 | 13 | 2018 |
| Glass interposer electromagnetic bandgap structure for efficient suppression of power/ground noise coupling Y Kim, J Cho, JJ Kim, K Cho, S Kim, S Sitaraman, V Sundaram, PM Raj, ... IEEE Transactions on Electromagnetic Compatibility 59 (3), 940-951, 2016 | 13 | 2016 |
| Channel characteristic-based deep neural network models for accurate eye diagram estimation in high bandwidth memory (HBM) silicon interposer D Lho, H Park, S Park, S Kim, H Kang, B Sim, S Kim, J Park, K Cho, ... IEEE Transactions on Electromagnetic Compatibility 64 (1), 196-208, 2021 | 12 | 2021 |
| Bayesian optimization of high-speed channel for signal integrity analysis D Lho, J Park, H Park, S Park, S Kim, H Kang, S Kim, G Park, K Son, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 12 | 2019 |
| Modeling and signal integrity analysis of 3D XPoint memory cells and interconnections with memory size variations during read operation K Son, K Cho, S Kim, G Park, K Song, J Kim 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018 | 12 | 2018 |
Kyungjun Chokorea institute of technology and scienceVerified email at alumni.kaist.ac.kr
