Coaxial cable Bragg grating sensor H Xiao, J Fan, T Wei, S Wu US Patent 9,046,342, 2015 | 230 | 2015 |
Signal integrity design for high-speed digital circuits: Progress and directions J Fan, X Ye, J Kim, B Archambeault, A Orlandi IEEE Transactions on Electromagnetic Compatibility 52 (2), 392-400, 2010 | 215 | 2010 |
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz R Rimolo-Donadio, X Gu, YH Kwark, MB Ritter, B Archambeault, ... IEEE Transactions on Microwave Theory and Techniques 57 (8), 2072-2083, 2009 | 154 | 2009 |
Analytical evaluation of via-plate capacitance for multilayer printed circuit boards and packages Y Zhang, J Fan, G Selli, M Cocchini, F de Paulis IEEE Transactions on Microwave Theory and Techniques 56 (9), 2118-2128, 2008 | 147 | 2008 |
An improved dipole-moment model based on near-field scanning for characterizing near-field coupling and far-field radiation from an IC Z Yu, JA Mix, S Sajuyigbe, KP Slattery, J Fan IEEE Transactions on electromagnetic compatibility 55 (1), 97-108, 2012 | 136 | 2012 |
An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances C Wang, J Mao, G Selli, S Luan, L Zhang, J Fan, DJ Pommerenke, ... IEEE Transactions on Advanced Packaging 29 (2), 320-334, 2006 | 129 | 2006 |
Quantifying SMT decoupling capacitor placement in DC power-bus design for multilayer PCBs J Fan, JL Drewniak, JL Knighten, NW Smith, A Orlandi, TP Van Doren, ... IEEE Transactions on Electromagnetic Compatibility 43 (4), 588-599, 2001 | 124 | 2001 |
Radiated two-stage method for LTE MIMO user equipment performance evaluation W Yu, Y Qi, K Liu, Y Xu, J Fan IEEE transactions on Electromagnetic Compatibility 56 (6), 1691-1696, 2014 | 91 | 2014 |
An intrinsic circuit model for multiple vias in an irregular plate pair through rigorous electromagnetic analysis YJ Zhang, J Fan IEEE transactions on microwave theory and techniques 58 (8), 2251-2265, 2010 | 83 | 2010 |
Estimating the noise mitigation effect of local decoupling in printed circuit boards J Fan, W Cui, JL Drewniak, TP Van Doren, JL Knighten IEEE Transactions on Advanced Packaging 25 (2), 154-165, 2002 | 82 | 2002 |
Coaxial cable Bragg grating T Wei, S Wu, J Huang, H Xiao, J Fan Applied Physics Letters 99 (11), 113517, 2011 | 78 | 2011 |
DC power-bus noise isolation with power-plane segmentation W Cui, J Fan, Y Ren, H Shi, JL Drewniak, RE DuBroff IEEE transactions on electromagnetic compatibility 45 (2), 436-443, 2003 | 76 | 2003 |
DC power-bus noise isolation with power-plane segmentation W Cui, J Fan, Y Ren, H Shi, JL Drewniak, RE DuBroff IEEE transactions on electromagnetic compatibility 45 (2), 436-443, 2003 | 76 | 2003 |
An effective method of probe calibration in phase-resolved near-field scanning for EMI application J Zhang, KW Kam, J Min, VV Khilkevich, D Pommerenke, J Fan IEEE transactions on instrumentation and measurement 62 (3), 648-658, 2012 | 64 | 2012 |
Signal/power integrity analysis for multilayer printed circuit boards using cascaded S-parameters F De Paulis, YJ Zhang, J Fan IEEE transactions on electromagnetic compatibility 52 (4), 1008-1018, 2010 | 61 | 2010 |
Estimating radio-frequency interference to an antenna due to near-field coupling using decomposition method based on reciprocity H Wang, V Khilkevich, YJ Zhang, J Fan IEEE transactions on electromagnetic compatibility 55 (6), 1125-1131, 2013 | 60 | 2013 |
Physics-based inductance extraction for via arrays in parallel planes for power distribution network design J Kim, L Ren, J Fan IEEE Transactions on Microwave Theory and Techniques 58 (9), 2434-2447, 2010 | 57 | 2010 |
Improved target impedance and IC transient current measurement for power distribution network design J Kim, S Wu, H Wang, Y Takita, H Takeuchi, K Araki, G Feng, J Fan 2010 IEEE International Symposium on Electromagnetic Compatibility, 445-450, 2010 | 56 | 2010 |
A coaxial cable Fabry-Perot interferometer for sensing applications J Huang, T Wang, L Hua, J Fan, H Xiao, M Luo Sensors 13 (11), 15252-15260, 2013 | 52 | 2013 |
A novel impedance definition of a parallel plate pair for an intrinsic via circuit model YJ Zhang, G Feng, J Fan IEEE transactions on microwave theory and techniques 58 (12), 3780-3789, 2010 | 52 | 2010 |