| Experimental and numerical analysis of scratching induced damage during diamond wire sawing of silicon F Wallburg, M Kuna, M Budnitzki, S Schoenfelder Wear 454, 203328, 2020 | 27 | 2020 |
| A material removal coefficient for diamond wire sawing of silicon F Wallburg, M Kuna, M Budnitzki, S Schoenfelder Wear 504, 204400, 2022 | 13 | 2022 |
| Numerical Flow Simulation on the Virus Spread of SARS-CoV-2 Due to Airborne Transmission in a Classroom L Moeller, F Wallburg, F Kaule, S Schoenfelder International Journal of Environmental Research and Public Health 19 (10), 6279, 2022 | 3 | 2022 |
| Material removal simulation in sawing processes of photovoltaic silicon F Wallburg, M Kuna, S Schoenfelder MRS Advances 4 (13), 761-768, 2019 | 3 | 2019 |
| Analysis of the compression behavior of different cardboard materials during embossing U Kaeppeler, K Schneller, F Wallburg, L Engisch, S Schoenfelder Open Conference Proceedings 2, 129-135, 2022 | 2 | 2022 |
| Influence of microcracks on strength of diamond wire sawn silicon substrates F Wallburg, K Meyer, M Budnitzki, M Kuna, F Kaule, S Schoenfelder Proceedings of the 8th International Conference on Fracture, Fatigue and …, 2021 | 2 | 2021 |
Stephan SchoenfelderProfessor, Leipzig University of Applied Sciences確認したメール アドレス: htwk-leipzig.de
