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Florian Wallburg
Florian Wallburg
Leipzig University of Applied Sciences
Verified email at htwk-leipzig.de - Homepage
Title
Cited by
Cited by
Year
Experimental and numerical analysis of scratching induced damage during diamond wire sawing of silicon
F Wallburg, M Kuna, M Budnitzki, S Schoenfelder
Wear 454, 203328, 2020
282020
A material removal coefficient for diamond wire sawing of silicon
F Wallburg, M Kuna, M Budnitzki, S Schoenfelder
Wear 504, 204400, 2022
162022
Numerical flow simulation on the virus spread of SARS-CoV-2 due to airborne transmission in a classroom
L Moeller, F Wallburg, F Kaule, S Schoenfelder
International Journal of Environmental Research and Public Health 19 (10), 6279, 2022
32022
Influence of microcracks on strength of diamond wire sawn silicon substrates
F Wallburg, K Meyer, M Budnitzki, M Kuna, F Kaule, S Schoenfelder
Proceedings of the 8th International Conference on Fracture, Fatigue and …, 2021
32021
Material removal simulation in sawing processes of photovoltaic silicon
F Wallburg, M Kuna, S Schoenfelder
MRS Advances 4 (13), 761-768, 2019
32019
Analysis of the compression behavior of different cardboard materials during embossing
U Kaeppeler, K Schneller, F Wallburg, L Engisch, S Schoenfelder
Open Conference Proceedings 2, 129-135, 2022
22022
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