| Deep reinforcement learning-based optimal decoupling capacitor design method for silicon interposer-based 2.5-D/3-D ICs H Park, J Park, S Kim, K Cho, D Lho, S Jeong, S Park, G Park, B Sim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 58 | 2020 |
| Reinforcement learning-based optimal on-board decoupling capacitor design method H Park, J Park, S Kim, D Lho, S Park, G Park, K Cho, J Kim 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 25 | 2018 |
| A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive … B Sim, S Jeong, Y Kim, S Park, S Lee, S Hong, J Song, H Kim, H Kang, ... IEEE Transactions on Electromagnetic Compatibility 63 (3), 935-946, 2020 | 20 | 2020 |
| Signal integrity and computing performance analysis of a processing-in-memory of high bandwidth memory (PIM-HBM) scheme S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 14 | 2021 |
| Processing-in-memory in high bandwidth memory (PIM-HBM) architecture with energy-efficient and low latency channels for high bandwidth system S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 14 | 2019 |
| Polynomial model-based eye diagram estimation methods for LFSR-based bit streams in PRBS test and scrambling J Park, S Park, Y Kim, G Park, H Park, D Lho, K Cho, S Lee, DH Kim, ... IEEE Transactions on Electromagnetic Compatibility 61 (6), 1867-1875, 2019 | 14 | 2019 |
| Channel characteristic-based deep neural network models for accurate eye diagram estimation in high bandwidth memory (HBM) silicon interposer D Lho, H Park, S Park, S Kim, H Kang, B Sim, S Kim, J Park, K Cho, ... IEEE Transactions on Electromagnetic Compatibility 64 (1), 196-208, 2021 | 12 | 2021 |
| Bayesian optimization of high-speed channel for signal integrity analysis D Lho, J Park, H Park, S Park, S Kim, H Kang, S Kim, G Park, K Son, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 12 | 2019 |
| Eye-width and eye-height estimation method based on artificial neural network (ANN) for USB 3.0 D Lho, J Park, H Park, H Kang, S Park, J Kim 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 10 | 2018 |
| Reinforcement-learning-based signal integrity optimization and analysis of a scalable 3-d x-point array structure K Son, M Kim, H Park, D Lho, K Son, K Kim, S Lee, S Jeong, S Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2021 | 9 | 2021 |
| Deep reinforcement learning-based through silicon via (TSV) array design optimization method considering crosstalk K Kim, H Park, D Lho, M Kim, K Son, K Son, S Kim, T Shin, S Choi, J Kim 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 7 | 2020 |
| Signal integrity modeling and analysis of large-scale memristor crossbar array in a high-speed neuromorphic system for deep neural network T Shin, S Park, S Kim, S Kim, K Son, H Park, D Lho, K Cho, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 6 | 2021 |
| Segmentation method based modeling and analysis of a glass package power distribution network (PDN) Y Kim, D Fujimoto, S Kaji, S Wada, H Park, D Lho, J Kim, Y Hayashi Nonlinear Theory and Its Applications, IEICE 11 (2), 170-188, 2020 | 5 | 2020 |
| Design and measurement of a 28 GHz glass band pass filter based on glass interposers for 5G applications G Park, K Cho, K Son, H Park, D Lho, S Kim, T Shin, Y Kim, J Kim, ... 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2019 | 5 | 2019 |
| Scalable transformer network-based reinforcement learning method for PSIJ optimization in HBM H Park, T Shin, S Kim, D Lho, B Sim, J Song, K Kong, J Kim 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging …, 2022 | 4 | 2022 |
| Modeling and Signal Integrity Analysis of Mounting Pad with Layer-cutting to reduce Impedance Mismatch for Dual-In-Line Memory Module (DIMM) H Kim, J Kim, K Song, S Lee, K Kim, S Kim, D Lho, H Kim, M Park, S Ahn 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 4 | 2021 |
| Signal integrity analysis of high speed channel considering thermal distribution K Son, S Kim, M Kim, D Lho, K Kim, H Park, G Park, J Kim 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 4 | 2021 |
| A deep neural network-based estimation of efficiency enhancement by an intermediate coil in automotive wireless power transfer system B Sim, D Lho, D Park, S Jeong, S Lee, H Kim, H Park, H Kang, S Hong, ... 2020 IEEE Wireless Power Transfer Conference (WPTC), 231-233, 2020 | 4 | 2020 |
| A deep neural network-based estimation of EMI reduction by an intermediate coil in automotive wireless power transfer system B Sim, D Lho, D Park, H Park, H Kang, J Kim 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 4 | 2020 |
| Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box K Son, S Choi, DH Jung, K Kim, G Park, D Lho, H Park, S Park, J Kim, ... 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 4 | 2019 |
