フォロー
Yosuke Hanawa
Yosuke Hanawa
その他の名前塙洋祐, Y. Hanawa, Yousuke Hanawa
SCREEN Holdings Co. Ltd.,
確認したメール アドレス: screen.co.jp
タイトル
引用先
引用先
Substrate treating apparatus and substrate treating method
Y Sasaki, Y Hanawa, S Nadahara, D Ueda, H Kitagawa, K Okumura
US Patent 10,153,181, 2018
172018
Substrate cleaning method and substrate cleaning apparatus
Y Sasaki, Y Hanawa, K Miya
US Patent 10,286,425, 2019
92019
Substrate treating method and substrate treating apparatus
Y Hanawa, Y Sasaki
US Patent 10,699,920, 2020
62020
Multi-scale analysis for solidification of phase change materials (PCMs): Experiments and modeling
M Xu, Y Hanawa, S Akhtar, A Sakuma, J Zhang, J Yoshida, M Sanada, ...
International Journal of Heat and Mass Transfer 212, 124182, 2023
42023
Breakthrough of Sublimation Drying by Liquid Phase Deposition
Y Sasaki, Y Hanawa, M Otsuji, N Fujiwara, M Kato, Y Yamaguchi, ...
Solid State Phenomena 314, 172-177, 2021
42021
Effect of Hydrophobicity and Surface Potential of Silicon on SiO2 Etching in Nanometer-Sized Narrow Spaces
D Ueda, Y Hanawa, H Kitagawa, N Fujiwara, M Otsuji, H Takahashi, ...
Solid State Phenomena 314, 155-160, 2021
42021
Substrate treating method and substrate treating apparatus
Y Hanawa, Y Sasaki
US Patent App. 16/037,016, 2019
42019
Vapor supplying apparatus, vapor drying apparatus, vapor supplying method, and vapor drying method
Y Hanawa, K Miya
US Patent 9,976,804, 2018
42018
Thermomechanical formulation of freezing point depression behavior of liquid on solid surface with nanostructure
Y Hanawa, Y Sasaki, S Uchida, T Funayoshi, M Otsuji, H Takahashi, ...
ASME International Mechanical Engineering Congress and Exposition 84591 …, 2020
32020
Substrate cleaning method and substrate cleaning apparatus
Y Hanawa, K Miya, Y Sasaki
US Patent 9,728,396, 2017
32017
Substrate processing method and substrate processing device
D Ueda, Y Sasaki, Y Hanawa, H Kitagawa
US Patent 11,897,009, 2024
22024
Substrate treating method and apparatus used therefor
Y Sasaki, Y Hanawa, S Kunieda
US Patent App. 17/893,750, 2023
12023
Model potential of dimer system and coherence length of electron injected by scanning tunneling microscope on Ge (0 0 1) surface
H Kawai, Y Yoshimoto, O Narikiyo, Y Hanawa, A Imamura
Surface science 602 (18), 3010-3017, 2008
12008
Substrate treating method, substrate treating apparatus and substrate treating liquid
S Kunieda, Y Sasaki, Y Hanawa
US Patent App. 18/452,977, 2024
2024
Substrate processing liquid for etching a metal layer, substrate processing method and substrate processing apparatus
D Ueda, Y Hanawa
US Patent 11,908,938, 2024
2024
Kinetics formulation for Two-Dimensional Growth Behavior of Water/Ice Interface on Si Substrate
Y Hanawa, J Zhang, AP Sasmito, M Xu, S Akhtar, M Mohit, J Yoshida, ...
Langmuir, 2024
2024
Learning device, information processing apparatus, substrate processing device, substrate processing system, learning method, recipe determination method and non-transitory …
Y Hanawa, Y Sasaki, S Kunieda
US Patent App. 17/878,242, 2023
2023
Substrate drying method and substrate drying apparatus
Y Hanawa, Y Sasaki
US Patent 11,158,523, 2021
2021
Substrate treating method and substrate treating apparatus
Y Hanawa, D Ueda, Y Sasaki
US Patent 11,133,175, 2021
2021
Substrate treating method, substrate treating liquid and substrate treating apparatus
Y Sasaki, Y Hanawa
US Patent 11,094,565, 2021
2021
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