| Heat dissipation design and analysis of high power LED array using the finite element method HH Cheng, DS Huang, MT Lin Microelectronics Reliability 52 (5), 905-911, 2012 | 191 | 2012 |
| Design of fins with a grooved heat pipe for dissipation of heat from high-powered automotive LED headlights DS Huang, TC Chen, LT Tsai, MT Lin Energy conversion and management 180, 550-558, 2019 | 64 | 2019 |
| Influence of in situ applied stress during thermal oxidation of (111)Si on interface defects A Stesmans, D Pierreux, RJ Jaccodine, MT Lin, TJ Delph Applied physics letters 82 (18), 3038-3040, 2003 | 43 | 2003 |
| Novel microtensile method for monotonic and cyclic testing of freestanding copper thin films MT Lin, CJ Tong, KS Shiu Experimental Mechanics 50, 55-64, 2010 | 29 | 2010 |
| Temperature-dependent microtensile testing of thin film materials for application to microelectromechanical system MT Lin, P El-Deiry, RR Chromik, N Barbosa, WL Brown, TJ Delph, ... Microsystem technologies 12, 1045-1051, 2006 | 28 | 2006 |
| Thin-film vertical-type AlGaInP LEDs fabricated by epitaxial lift-off process via the patterned design of Cu substrate FL Wu, SL Ou, YC Kao, CL Chen, MC Tseng, FC Lu, MT Lin, RH Horng Optics Express 23 (14), 18156-18165, 2015 | 26 | 2015 |
| Driving forces for texture transformation in thin Ag films EA Ellis, M Chmielus, MT Lin, H Joress, K Visser, A Woll, RP Vinci, ... Acta Materialia 105, 495-504, 2016 | 25 | 2016 |
| Microsyst. Technol MT Lin, MT Lin, SP Wu, FG Tseng | 25 | 2006 |
| Effects of electrical current and external stress on the electromigration of intermetallic compounds between the flip-chip solder and copper substrate WJ Chen, YL Lee, TY Wu, TC Chen, CH Hsu, MT Lin Journal of Electronic Materials 47, 35-48, 2018 | 23 | 2018 |
| Viscoelastic mechanical properties measurement of thin Al and Al–Mg films using bulge testing AW Huang, CH Lu, SC Wu, TC Chen, RP Vinci, WL Brown, MT Lin Thin Solid Films 618, 2-7, 2016 | 22 | 2016 |
| Optical micro-paddle beam deflection measurement for electrostatic mechanical testing of nano-scale thin film application to MEMS CJ Tong, YC Cheng, MT Lin, KJ Chung, JS Hsu, CL Wu microsystem technologies 16, 1131-1137, 2010 | 20 | 2010 |
| Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains WK Liao, CM Chen, MT Lin, CH Wang Scripta Materialia 65 (8), 691-694, 2011 | 19 | 2011 |
| Design and development of a novel paddle test structure for the mechanical behavior measurement of thin films application for MEMS CJ Tong, MT Lin Microsystem technologies 15, 1207-1216, 2009 | 16 | 2009 |
| Heat dissipation performance for the application of light emitting diode MT Lin, C Chang, RH Horng, DS Huang, CM Lai 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 145-149, 2009 | 16 | 2009 |
| Advancements in optical methods & digital image correlation in experimental mechanics MT Lin, CA Sciammarella, HD Espinosa, C Furlong, L Lamberti, P Reu, ... Springer, 2020 | 15* | 2020 |
| Cyclic creep and fatigue testing of nanocrystalline copper thin films TC Hu, YT Wang, FC Hsu, PK Sun, MT Lin Surface and Coatings Technology 215, 393-399, 2013 | 14 | 2013 |
| Design and development of sub-micron scale specimens with electroplated structures for the microtensile testing of thin films MT Lin, CJ Tong, CH Chiang Microsystem technologies 13, 1559-1565, 2007 | 13 | 2007 |
| Monotonic and fatigue testing of freestanding submicron thin beams application for MEMS MT Lin, CJ Tong, KS Shiu Microsystem technologies 14, 1041-1048, 2008 | 12 | 2008 |
| The influence of vanadium alloying on the elevated-temperature mechanical properties of thin gold films MT Lin, RR Chromik, N Barbosa III, P El-Deiry, S Hyun, WL Brown, ... Thin Solid Films 515 (20-21), 7919-7925, 2007 | 12 | 2007 |
| Planar oxidation of strained silicon substrates MT Lin, RJ Jaccodine, TJ Delph Journal of Materials Research 16 (3), 728-733, 2001 | 12 | 2001 |
Luciano LambertiProfessore Associato di Costruzione di Macchine確認したメール アドレス: poliba.it
