| Signal integrity design and analysis of differential high-speed serial links in silicon interposer with through-silicon via K Cho, Y Kim, H Lee, J Song, J Park, S Lee, S Kim, G Park, K Son, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018 | 30 | 2018 |
| Signal integrity and computing performance analysis of a processing-in-memory of high bandwidth memory (PIM-HBM) scheme S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 14 | 2021 |
| Processing-in-memory in high bandwidth memory (PIM-HBM) architecture with energy-efficient and low latency channels for high bandwidth system S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 14 | 2019 |
| Measurement, simulation and mathematical estimation of magnetic field shielding effectiveness of sputtered shielding materials using spiral coils K Song, S Kim, S Jeong, DH Kim, K Son, J Heo, K Han, Y Jung, H Kim, ... 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018 | 14 | 2018 |
| Signal integrity design and analysis of 3-D X-point memory considering crosstalk and IR drop for higher performance computing K Son, K Cho, S Kim, S Park, DH Jung, J Park, G Park, S Kim, T Shin, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 13 | 2020 |
| Measurement and analysis of through glass via noise coupling and shielding structures in a glass interposer G Park, Y Kim, K Cho, J Park, I Hwang, J Kim, K Son, H Park, ... IEEE Transactions on Electromagnetic Compatibility 63 (5), 1562-1573, 2021 | 12 | 2021 |
| Bayesian optimization of high-speed channel for signal integrity analysis D Lho, J Park, H Park, S Park, S Kim, H Kang, S Kim, G Park, K Son, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 12 | 2019 |
| Modeling and signal integrity analysis of 3D XPoint memory cells and interconnections with memory size variations during read operation K Son, K Cho, S Kim, G Park, K Song, J Kim 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018 | 12 | 2018 |
| Reinforcement-learning-based signal integrity optimization and analysis of a scalable 3-d x-point array structure K Son, M Kim, H Park, D Lho, K Son, K Kim, S Lee, S Jeong, S Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2021 | 9 | 2021 |
| Deep Reinforcement Learning-based Interconnection Design for 3D X-Point Array Structure Considering Signal Integrity K Son, M Kim, H Park, S Park, G Park, D Lho, S Kim, T Shin, K Son, K Kim, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021 | 9* | 2021 |
| Policy gradient reinforcement learning-based optimal decoupling capacitor design method for 2.5-d/3-d ics using transformer network H Park, M Kim, S Kim, S Jeong, S Kim, H Kang, K Kim, K Son, G Park, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 9 | 2020 |
| Modeling and analysis of system-level power supply noise induced jitter (PSIJ) for 4 Gbps high bandwidth memory (HBM) I/O interface T Shin, H Park, K Kim, S Kim, K Son, K Son, G Park, J Park, S Choi, J Kim 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021 | 7 | 2021 |
| Design and analysis of thermal transmission line based embedded cooling structures for high bandwidth memory module and 2.5 D/3D ICs K Son, S Kim, S Park, H Park, K Kim, T Shin, M Kim, K Son, G Park, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 7 | 2020 |
| Deep reinforcement learning-based through silicon via (TSV) array design optimization method considering crosstalk K Kim, H Park, D Lho, M Kim, K Son, K Son, S Kim, T Shin, S Choi, J Kim 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 7 | 2020 |
| Impact of on-chip interconnection in a large-scale memristor crossbar array for neural network accelerator and neuromorphic chip T Shin, K Son, S Kim, K Cho, S Park, S Kim, G Park, B Sim, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 7 | 2019 |
| High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test J Park, H Kim, JJ Kim, DH Kim, K Son, S Kim, S Lee, K Cho, B Bae, D Ha, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 7 | 2018 |
| Signal integrity modeling and analysis of large-scale memristor crossbar array in a high-speed neuromorphic system for deep neural network T Shin, S Park, S Kim, S Kim, K Son, H Park, D Lho, K Cho, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 6 | 2021 |
| Signal and power integrity (SI/PI) analysis of heterogeneous integration using embedded multi-die interconnect bridge (EMIB) technology for high bandwidth memory (HBM) K Cho, Y Kim, H Lee, G Park, S Kim, K Son, S Choi, J Kim 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2017 | 6 | 2017 |
| Design and measurement of a 28 GHz glass band pass filter based on glass interposers for 5G applications G Park, K Cho, K Son, H Park, D Lho, S Kim, T Shin, Y Kim, J Kim, ... 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2019 | 5 | 2019 |
| Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box K Son, S Choi, DH Jung, K Kim, G Park, D Lho, H Park, S Park, J Kim, ... 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 4 | 2019 |
