フォロー
Steven E. Steen
Steven E. Steen
IBM, ASML
確認したメール アドレス: asml.com
タイトル
引用先
引用先
Three-dimensional integrated circuits
AW Topol, DC La Tulipe, L Shi, DJ Frank, K Bernstein, SE Steen, A Kumar, ...
IBM Journal of Research and Development 50 (4.5), 491-506, 2006
9022006
Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
AW Topol, DC La Tulipe, L Shi, SM Alam, DJ Frank, SE Steen, J Vichiconti, ...
IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest …, 2005
3422005
Methods of forming wiring to transistor and related transistor
DJ Frank, DC La Tulipe Jr, SE Steen, AW Topol
US Patent 7,666,723, 2010
2492010
Overlay as the key to drive wafer scale 3D integration
SE Steen, D LaTulipe, AW Topol, DJ Frank, K Belote, D Posillico
Microelectronic engineering 84 (5-8), 1412-1415, 2007
2442007
Electrical characterization of germanium p-channel MOSFETs
H Shang, H Okorn-Schimdt, J Ott, P Kozlowski, S Steen, EC Jones, ...
IEEE Electron Device Letters 24 (4), 242-244, 2003
2072003
High mobility p-channel germanium MOSFETs with a thin Ge oxynitride gate dielectric
H Shang, H Okorn-Schmidt, KK Chan, M Copel, JA Ott, PM Kozlowski, ...
Digest. International Electron Devices Meeting,, 441-444, 2002
1622002
On the integration of CMOS with hybrid crystal orientations
M Yang, V Chan, SH Ku, M Ieong, L Shi, KK Chan, CS Murthy, RT Mo, ...
Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004., 160-161, 2004
592004
The over-bump applied resin wafer-level underfill process: Process, material and reliability
C Feger, N LaBianca, M Gaynes, S Steen, Z Liu, R Peddi, M Francis
2009 59th electronic components and technology conference, 1502-1505, 2009
512009
The attack of the" Holey Shmoos": a case study of advanced DFD and picosecond imaging circuit analysis (PICA)
W Huott, M McManus, D Knebel, S Steen, D Manzer, P Sanda, S Wilson, ...
International Test Conference 1999. Proceedings (IEEE Cat. No. 99CH37034 …, 1999
291999
Lateral displacement induced disorder in L10-FePt nanostructures by ion-implantation
N Gaur, S Kundu, SN Piramanayagam, SL Maurer, HK Tan, SK Wong, ...
Scientific reports 3 (1), 1907, 2013
282013
System and method for virtual control of laboratory equipment
F Stellari, SE Steen, P Song
US Patent 8,041,437, 2011
262011
Aggressively scaled (0.143/spl mu/m/sup 2/) 6T-SRAM cell for the 32 nm node and beyond
DM Fried, JM Hergenrother, AW Topol, L Chang, L Sekaric, JW Sleight, ...
IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 …, 2004
252004
PICA: Backside failure analysis of CMOS circuits using Picosecond Imaging Circuit Analysis
MK Mc Manus, JA Kash, SE Steen, S Polonsky, JC Tsang, DR Knebel, ...
Microelectronics Reliability 40 (8-10), 1353-1358, 2000
252000
Hybrid lithography: The marriage between optical and e-beam lithography. A method to study process integration and device performance for advanced device nodes
S Steen, SJ McNab, L Sekaric, I Babich, J Patel, J Bucchignano, M Rooks, ...
Microelectronic engineering 83 (4-9), 754-761, 2006
202006
Laterally scaled Si-Si/sub 0.7/Ge/sub 0.3/n-MODFETs with f/sub max/> 200 GHz and low operating bias
SJ Koester, KL Saenger, JO Chu, QC Ouyang, JA Ott, KA Jenkins, ...
IEEE electron device letters 26 (3), 178-180, 2005
192005
Picosecond imaging circuit analysis of the IBM G6 microprocessor cache
M McManus, P Sanda, S Steen, D Knebel, D Manzer, S Polonsky, B Huott, ...
ISTFA 1999, 35-38, 1999
191999
Looking into the crystal ball: Future device learning using hybrid E-beam and optical lithography
SE Steen, SJ McNab, L Sekaric, I Babich, J Patel, J Bucchignano, ...
Emerging Lithographic Technologies IX 5751, 26-34, 2005
182005
80 nm gate-length Si/Si0. 7Ge0. 3n-MODFET with 194 GHz fmax
SJ Koester, KL Saenger, JO Chu, QC Ouyang, JA Ott, MJ Rooks, ...
Electronics Letters 39 (23), 1684-1685, 2003
162003
Methods of fabricating solar cell chips
HJ Eickelmann, M Haag, HJ Hovel, RK Krause, M Schmidt, X Shao, ...
US Patent 7,897,434, 2011
152011
Method of manufacturing solar cell with doping patterns and contacts
HJ Eickelmann, M Haag, HJ Hovel, R Krause, M Schmidt, SE Steen
US Patent 8,129,216, 2012
142012
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論文 1–20