Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias M Murugesan, H Kino, H Nohira, JC Bea, A Horibe, F Yamada, ... 2010 International Electron Devices Meeting, 2.3. 1-2.3. 4, 2010 | 116 | 2010 |
New heterogeneous multi-chip module integration technology using self-assembly method T Fukushima, T Konno, K Kiyoyama, M Murugesan, K Sato, WC Jeong, ... 2008 IEEE International Electron Devices Meeting, 1-4, 2008 | 58 | 2008 |
Reconfigured-wafer-to-wafer 3-D integration using parallel self-assembly of chips with Cu–SnAg microbumps and a nonconductive film T Fukushima, J Bea, H Kino, C Nagai, M Murugesan, H Hashiguchi, ... IEEE Transactions on Electron Devices 61 (2), 533-539, 2014 | 53 | 2014 |
High density 3D LSI technology using W/Cu hybrid TSVs M Murugesan, H Kino, A Hashiguchi, C Miyazaki, H Shimamoto, ... 2011 International Electron Devices Meeting, 6.6. 1-6.6. 4, 2011 | 44 | 2011 |
Impact of remnant stress/strain and metal contamination in 3D-LSIs with through-Si vias fabricated by wafer thinning and bonding M Murugesan, JC Bea, H Kino, Y Ohara, T Kojima, A Noriki, KW Lee, ... 2009 IEEE International Electron Devices Meeting (IEDM), 1-4, 2009 | 44 | 2009 |
MOSFET Nonvolatile Memory with High-Density Cobalt-Nanodots Floating Gate andHigh-k Blocking Dielectric Y Pei, C Yin, T Kojima, JC Bea, H Kino, T Fukushima, T Tanaka, ... IEEE transactions on nanotechnology 10 (3), 528-531, 2010 | 35 | 2010 |
Oxide-oxide thermocompression direct bonding technologies with capillary self-assembly for multichip-to-wafer heterogeneous 3D system integration T Fukushima, H Hashiguchi, H Yonekura, H Kino, M Murugesan, JC Bea, ... Micromachines 7 (10), 184, 2016 | 19 | 2016 |
Development of highly-reliable microbump bonding technology using self-assembly of NCF-covered KGDs and multi-layer 3D stacking challenges Y Ito, M Murugesan, H Kino, T Fukushima, KW Lee, K Choki, T Tanaka, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 336-341, 2015 | 19 | 2015 |
Cu lateral interconnects formed between 100-µm-thick self-assembled chips on flexible substrates M Murugesan, JC Bea, T Fukushima, T Konno, K Kiyoyama, WC Jeong, ... 2009 59th Electronic Components and Technology Conference, 1496-1501, 2009 | 19 | 2009 |
Multiple optical stimulation to neuron using Si opto-neural probe with multiple optical waveguides and metal-cover for optogenetics S Kanno, S Lee, T Harashima, T Kuki, H Kino, H Mushiake, H Yao, ... 2013 35th Annual International Conference of the IEEE Engineering in …, 2013 | 15 | 2013 |
Ultrafast parallel reconfiguration of 3D-stacked reconfigurable spin logic chip with on-chip SPRAM (SPin-transfer torque RAM) T Tanaka, H Kino, R Nakazawa, K Kiyoyama, H Ohno, M Koyanagi 2012 Symposium on VLSI Technology (VLSIT), 169-170, 2012 | 15 | 2012 |
Self-assembly and electrostatic carrier technology for via-last TSV formation using transfer stacking-based chip-to-wafer 3-D integration H Hashiguchi, T Fukushima, H Hashimoto, JC Bea, M Murugesan, H Kino, ... IEEE Transactions on Electron Devices 64 (12), 5065-5072, 2017 | 14 | 2017 |
Investigation of local bending stress effect on complementary metal–oxide–semiconductor characteristics in thinned Si chip for chip-to-wafer three-dimensional integration H Kino, JC Bea, M Murugesan, KW Lee, T Fukushima, M Koyanagi, ... Japanese Journal of Applied Physics 52 (4S), 04CB11, 2013 | 14 | 2013 |
Impact of chip-edge structures on alignment accuracies of self-assembled dies for microelectronic system integration Y Ito, T Fukushima, H Kino, KW Lee, T Tanaka, M Koyanagi Journal of Microelectromechanical Systems 25 (1), 91-100, 2015 | 13 | 2015 |
Development of eccentric spin coating of polymer liner for low-temperature TSV technology with ultra-fine diameter M Xiong, Z Chen, Y Ding, H Kino, T Fukushima, T Tanaka IEEE Electron Device Letters 40 (1), 95-98, 2018 | 12 | 2018 |
Remarkable suppression of local stress in 3D IC by manganese nitride-based filler with large negative CTE H Kino, T Fukushima, T Tanaka 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1523-1528, 2017 | 12 | 2017 |
Temporary spin-on glass bonding technologies for via-last/backside-via 3D integration using multichip self-assembly H Hashiguchi, T Fukushima, A Noriki, H Kino, KW Lee, T Tanaka, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 856-861, 2014 | 11 | 2014 |
Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC H Kino, H Hashiguchi, S Tanikawa, Y Sugawara, S Ikegaya, T Fukushima, ... Japanese Journal of Applied Physics 55 (4S), 04EC03, 2016 | 10 | 2016 |
Plasma assisted multichip-to-wafer direct bonding technology for self-assembly based 3D integration H Hashiguchi, H Yonekura, T Fukushima, M Murugesan, H Kino, KW Lee, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1458-1463, 2015 | 9 | 2015 |
Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration Y Ito, T Fukushima, H Kino, KW Lee, K Choki, T Tanaka, M Koyanagi Japanese Journal of Applied Physics 54 (3), 030206, 2015 | 9 | 2015 |