Sungdong Kim
Sungdong Kim
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Scanning resistive probe microscopy: Imaging ferroelectric domains
H Park, J Jung, DK Min, S Kim, S Hong, H Shin
Applied physics letters 84 (10), 1734-1736, 2004
Interface, Volume, and Thermal Attenuation of Hot-Electron Spins in Ni_ {80} Fe_ {20} and Co
R Vlutters, OMJ Van't Erve, SD Kim, R Jansen, JC Lodder
Physical review letters 88 (2), 27202, 2001
Transfer ratio of the spin-valve transistor
OMJ van’t Erve, R Vlutters, PSA Kumar, SD Kim, FM Postma, R Jansen, ...
Applied physics letters 80 (20), 3787-3789, 2002
Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics
M Park, S Baek, S Kim, SE Kim
Applied Surface Science 324, 168-173, 2015
The spin-valve transistor: fabrication, characterization, and physics
R Jansen, OMJ Van’t Erve, SD Kim, R Vlutters, PS Anil Kumar, JC Lodder
Journal of applied physics 89 (11), 7431-7436, 2001
Magnetoresistance behavior of a magnetic tunnel junction with perpendicularly magnetized multilayers
D Lim, S Kim, SR Lee
Journal of applied physics 97 (10), 10C902, 2005
Wafer warpage analysis of stacked wafers for 3D integration
Y Kim, SK Kang, SD Kim, SE Kim
Microelectronic Engineering 89, 46-49, 2012
Modeling of spin-dependent hot-electron transport in the spin-valve transistor
R Vlutters, OMJ van’t Erve, R Jansen, SD Kim, JC Lodder, A Vedyayev, ...
Physical Review B 65 (2), 024416, 2001
Effect of radio frequency power on the properties of p-type SnO deposited via sputtering
J Um, BM Roh, S Kim, SE Kim
Materials science in semiconductor processing 16 (6), 1679-1683, 2013
Assessment of dry etching damage in permalloy thin films
SD Kim, JJ Lee, SH Lim, HJ Kim
Journal of applied physics 85 (8), 5992-5994, 1999
Method of writing data on a storage device using a probe technique
S Hong, SD Kim, JH Jung, D Min, HS Park, K Baeck, C Park, YS Kim
US Patent 7,406,020, 2008
Wafer level Cu–Cu direct bonding for 3D integration
SE Kim, S Kim
Microelectronic Engineering 137, 158-163, 2015
300% magnetocurrent in a room temperature operating spin-valve transistor
PSA Kumar, R Jansen, OMJ van’t Erve, R Vlutters, SD Kim, JC Lodder
Physica C: Superconductivity 350 (3-4), 166-170, 2001
Fabrication and challenges of Cu-to-Cu wafer bonding
SG Kang, JE Lee, ES Kim, NE Lim, SH Kim, SD Kim, SEK Kim
Journal of the Microelectronics and Packaging Society 19 (2), 29-33, 2012
Analysis of electromigration for Cu pillar bump in flip chip package
JH Yoo, IS Kang, GJ Jung, S Kim, HS Ahn, WH Choi, KS Jun, DW Jang, ...
2010 12th Electronics Packaging Technology Conference, 129-133, 2010
Wafer Level Bonding Technology for 3D Stacked IC
YH Cho, SE Kim, S Kim
Journal of the Microelectronics and Packaging Society 20 (1), 7-13, 2013
TSV liquid cooling system for 3D integrated circuits
M Park, S Kim, SE Kim
Journal of the Microelectronics and Packaging Society 20 (3), 1-6, 2013
Fabrication of atomic force microscope probe with low spring constant using SU-8 photoresist
J Lee, H Shin, S Kim, S Hong, J Chung, H Park, J Moon
Japanese journal of applied physics 42 (10A), L1171, 2003
The effects of heat treatment on room temperature ferromagnetism in a digitally Co doped ZnO thin film
S Kang, Y Kim, SE Kim, S Kim
Electronic Materials Letters 9 (1), 7-11, 2013
Hot-electron transport through in a spin-valve transistor
R Vlutters, R Jansen, OMJ van’t Erve, SD Kim, JC Lodder
Journal of applied physics 89 (11), 7305-7307, 2001
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