フォロー
Knut E Aasmundtveit
Knut E Aasmundtveit
Professor, University of South-Eastern Norway
確認したメール アドレス: usn.no
タイトル
引用先
引用先
Au-Sn SLID bonding—properties and possibilities
TA Tollefsen, A Larsson, OM Løvvik, K Aasmundtveit
Metallurgical and materials transactions B 43, 397-405, 2012
1132012
Optimized Cu-Sn wafer-level bonding using intermetallic phase characterization
TT Luu, ANI Duan, KE Aasmundtveit, N Hoivik
Journal of Electronic Materials 42, 3582-3592, 2013
902013
Intermetallic compound formation mechanisms for Cu-Sn solid–liquid interdiffusion bonding
H Liu, K Wang, KE Aasmundtveit, N Hoivik
Journal of electronic materials 41, 2453-2462, 2012
802012
High temperature interconnect and die attach technology: Au–Sn SLID bonding
TA Tollefsen, A Larsson, OM Løvvik, KE Aasmundtveit
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (6 …, 2013
682013
Wafer-level Cu/Sn to Cu/Sn SLID-bonded interconnects with increased strength
H Liu, G Salomonsen, K Wang, KE Aasmundtveit, N Hoivik
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (9 …, 2011
662011
Rheological characterization of a novel isotropic conductive adhesive–Epoxy filled with metal-coated polymer spheres
HV Nguyen, E Andreassen, H Kristiansen, R Johannessen, N Hoivik, ...
Materials & Design (1980-2015) 46, 784-793, 2013
552013
Au-Sn SLID bonding: A reliable HT interconnect and die attach technology
TA Tollefsen, A Larsson, MMV Taklo, A Neels, X Maeder, K Høydalsvik, ...
Metallurgical and Materials Transactions B 44, 406-413, 2013
502013
Fluxless wafer-level Cu-Sn bonding for micro-and nanosystems packaging
N Hoivik, K Wang, K Aasmundtveit, G Salomonsen, A Lapadatu, ...
3rd Electronics System Integration Technology Conference ESTC, 1-5, 2010
442010
Assembly and packaging of a three-axis micro accelerometer used for detection of heart infarction
K Imenes, K Aasmundtveit, EM Husa, JO Høgetveit, S Halvorsen, OJ Elle, ...
Biomedical Microdevices 9, 951-957, 2007
432007
Wafer‐Level Solid–Liquid Interdiffusion Bonding
N Hoivik, K Aasmundtveit
Handbook of wafer bonding, 181-214, 2012
352012
Effect of temperature on the die shear strength of a Au-Sn SLID bond
TA Tollefsen, OM Løvvik, K Aasmundtveit, A Larsson
Metallurgical and Materials Transactions A 44, 2914-2916, 2013
332013
Au-Sn fluxless SLID bonding: Effect of bonding temperature for stability at high temperature, above 400 C
KE Aasmundtveit, TT Luu, HV Nguyen, R Johannessen, N Hoivik, K Wang
3rd Electronics System Integration Technology Conference ESTC, 1-6, 2010
332010
Au–sn SLID bonding: Fluxless bonding with high temperature stability to above 350 °c
KE Aasmundtveit, K Wang, N Hoivik, JM Graff, A Elfving
2009 European Microelectronics and Packaging Conference, 1-6, 2009
272009
Carbon nanotube based gas sensor for expiration detection of perishable food
HQ Nguyen, BQ Ta, N Hoivik, E Halvorsen, KE Aasmundtveit
2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013 …, 2013
242013
Intermetallic Cu3Sn as oxidation barrier for fluxless Cu-Sn bonding
H Liu, K Wang, K Aasmundtveit, N Hoivik
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
192010
Cu/Sn SLID wafer-level bonding optimization
TT Luu, A Duan, K Wang, K Aasmundtveit, N Hoivik
2013 IEEE 63rd Electronic Components and Technology Conference, 1531-1537, 2013
182013
Characterization of wafer-level au-in-bonded samples at elevated temperatures
TT Luu, N Hoivik, K Wang, KE Aasmundtveit, ASB Vardøy
Metallurgical and Materials Transactions A 46, 2637-2645, 2015
172015
Solid-Liquid Interdiffusion (SLID) bonding—Intermetallic bonding for high temperature applications
KE Aasmundtveit, TA Tollefsen, TT Luu, A Duan, K Wang, N Hoivik
2013 Eurpoean Microelectronics Packaging Conference (EMPC), 1-6, 2013
172013
Die Shear Testing of a Novel Isotropic Conductive Adhesive—Epoxy Filled With Metal-Coated Polymer Spheres
HV Nguyen, E Andreassen, H Kristiansen, KE Aasmundtveit
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (7 …, 2013
172013
Direct integration of carbon nanotubes in Si microstructures
KE Aasmundtveit, BQ Ta, L Lin, E Halvorsen, N Hoivik
Journal of Micromechanics and Microengineering 22 (7), 074006, 2012
172012
現在システムで処理を実行できません。しばらくしてからもう一度お試しください。
論文 1–20