| Ultraprecision CMP for sapphire, GaN, and SiC for advanced optoelectronics materials H Aida, T Doi, H Takeda, H Katakura, SW Kim, K Koyama, T Yamazaki, ... Current Applied Physics 12, S41-S46, 2012 | 271 | 2012 |
| A study on combined vibration drilling by ultrasonic and low-frequency vibrations for hard and brittle materials K Ishikawa, H Suwabe, T Nishide, M Uneda Precision engineering 22 (4), 196-205, 1998 | 137 | 1998 |
| Novel chemical mechanical polishing/plasma-chemical vaporization machining (CMP/P-CVM) combined processing of hard-to-process crystals based on innovative concepts TK Doi, Y Sano, S Kurowaka, H Aida, O Ohnishi, M Uneda, K Ohyama Sensors and Materials 26 (6), 403-415, 2014 | 31 | 2014 |
| Relationships between contact image analysis results for pad surface texture and removal rate in CMP M Uneda, Y Maeda, K Ishikawa, K Ichikawa, T Doi, T Yamazaki, H Aida Journal of The Electrochemical Society 159 (2), H90, 2011 | 27 | 2011 |
| Fabrication mechanism for patterned sapphire substrates by wet etching N Aota, H Aida, Y Kimura, Y Kawamata, M Uneda ECS Journal of Solid State Science and Technology 3 (5), N69, 2014 | 26 | 2014 |
| Highly efficient chemical mechanical polishing method for SiC substrates using enhanced slurry containing bubbles of ozone gas M Uneda, K Fujii Precision Engineering 64, 91-97, 2020 | 21 | 2020 |
| A basic study of the behavior of slurry action at multi-wire saw KI Ishikawa, H Suwabe, SI Itoh, M Uneda Key Engineering Materials 238, 89-92, 2003 | 19 | 2003 |
| Effects of atmosphere and ultraviolet light irradiation on chemical mechanical polishing characteristics of SiC wafers O Ohnishi, T Doi, S Kurokawa, T Yamazaki, M Uneda, T Yin, I Koshiyama, ... Japanese journal of applied physics 51 (5S), 05EF05, 2012 | 15 | 2012 |
| Studies on non-contact deformation and measurement technique of structures using sub-pixel image processing M Uneda, M Shibahara, M Matsuishi, S Iwata, K Kitamura, K Ishikawa Journal of the Japan Society of Precision Engineering 72 (3), 360-365, 2006 | 15 | 2006 |
| Investigation into chemical mechanical polishing mechanism of hard-to-process materials using a commercially available single-sided polisher M Uneda, K Takano, K Koyama, H Aida, K Ishikawa International Journal of Automation Technology 9 (5), 573-579, 2015 | 12 | 2015 |
| Real-time evaluation of tool flank wear by in-process contact resistance measurement in face milling M Murata, S Kurokawa, O Ohnishi, M Uneda, T Doi Journal of Advanced Mechanical Design, Systems, and Manufacturing 6 (6), 958-970, 2012 | 12 | 2012 |
| Development of evaluation method for geometrical characterization of polishing pad surface texture based on contact image analysis using image rotation prism-Relationship … U Michio Journal of the Japan Society for Precision Engineering 77 (9), 883, 2011 | 11 | 2011 |
| Basic study on etching selectivity of plasma chemical vaporization machining by introducing crystallographic damage into work surface Y Sano, T Doi, S Kurokawa, H Aida, O Ohnishi, M Uneda, Y Okada, ... Key Engineering Materials 625, 550-553, 2014 | 9 | 2014 |
| Study on accuracy evaluation of deformation and strain distribution measurement using digital image correlation method M Uneda, S Okuhata, K Ishikawa Transactions of the Japan Society of Mechanical Engineers, Part C 76 (763 …, 2010 | 9 | 2010 |
| Direction/time of arrivals (D/TOA) estimation characteristics of the MUSIC algorithm for the actual extended targets of the chirp pulse tracking radar M Uneda, H Hokazono Proceedings of the 2002 IEEE Radar Conference (IEEE Cat. No. 02CH37322), 135-140, 2002 | 9 | 2002 |
| Development of evaluation method for geometrical characterization of polishing pad surface texture based on contact image analysis using image rotation prism-Effect of mesh … M Uneda J. Jpn. Soc. Prec. Eng. 76 (11), 1276, 2010 | 8 | 2010 |
| Analysis of sapphire-chemical mechanical polishing using digital image processing M Uneda, K Takano, K Koyama, H Aida, K Ishikawa Mechanical Engineering Journal 3 (1), 15-00509-15-00509, 2016 | 7 | 2016 |
| Effects of N-face finishing on geometry of double-side polished GaN substrate K Koyama, H Aida, M Uneda, H Takeda, SW Kim, H Takei, T Yamazaki, ... International Journal of Automation Technology 8 (1), 121-127, 2014 | 7 | 2014 |
| Effect of slurry on slicing characteristics of multi-wire saw KI Ishikawa, H Suwabe, M Uneda, T Matsukawa, A Kitajima JOURNAL-JAPAN SOCIETY FOR PRECISION ENGINEERING 66 (10), 1631-1635, 2000 | 7 | 2000 |
| Development of system for evaluation of polishing pad surface asperity M Uneda, Y Maeda, K Shibuya, Y Nakamura, D Ichikawa, K Ishikawa J. Jpn. Soc. Abrasive Tech 57 (6), 381-386, 2013 | 6 | 2013 |
