| Through silicon via (TSV) defect modeling, measurement, and analysis DH Jung, Y Kim, JJ Kim, H Kim, S Choi, YH Song, HC Bae, KS Choi, ... IEEE transactions on components, packaging and manufacturing technology 7 (1 …, 2016 | 58 | 2016 |
| Signal integrity design and analysis of silicon interposer for GPU-memory channels in high-bandwidth memory interface K Cho, Y Kim, H Lee, H Kim, S Choi, J Song, S Kim, J Park, S Lee, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018 | 50 | 2018 |
| Design optimization of high bandwidth memory (HBM) interposer considering signal integrity K Cho, H Lee, H Kim, S Choi, Y Kim, J Lim, J Kim, H Kim, Y Kim, Y Kim 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2015 | 27 | 2015 |
| Design and analysis of power distribution network (PDN) for high bandwidth memory (HBM) interposer in 2.5 D terabyte/s bandwidth graphics module K Cho, Y Kim, H Lee, H Kim, S Choi, S Kim, J Kim 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 407-412, 2016 | 25 | 2016 |
| A wideband on-interposer passive equalizer design for chip-to-chip 30-Gb/s serial data transmission H Kim, J Cho, J Kim, S Choi, K Kim, J Lee, K Park, JS Pak, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (1 …, 2014 | 23 | 2014 |
| Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module H Lee, K Cho, H Kim, S Choi, J Lim, J Kim 2015 International 3D Systems Integration Conference (3DIC), TS2. 2.1-TS2. 2.4, 2015 | 17 | 2015 |
| Modeling and analysis of TSV noise coupling effects on RF LC-VCO and shielding structures in 3D IC J Lim, J Cho, DH Jung, JJ Kim, S Choi, DH Kim, M Lee, J Kim IEEE Transactions on Electromagnetic Compatibility 60 (6), 1939-1947, 2018 | 16 | 2018 |
| Power distribution network (PDN) design and analysis of a single and double-sided high bandwidth memory (HBM) interposer for 2.5 D terabtye/s bandwidth system K Cho, Y Kim, S Kim, H Lee, S Choi, H Kim, J Kim 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 96-99, 2016 | 16 | 2016 |
| Design of an on-interposer passive equalizer for high bandwidth memory (HBM) with 30Gbps data transmission Y Jeon, H Kim, S Choi, Y Kim, J Kim 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2475-2480, 2016 | 16 | 2016 |
| Signal integrity of bump-less high-speed through silicon via channel for terabyte/s bandwidth 2.5 D IC H Lee, H Kim, S Choi, J Lim, K Cho, Y Jeon, J Shim, H Kim, YJ Kim, J Kim 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2519-2522, 2016 | 16 | 2016 |
| A novel stochastic model-based eye-diagram estimation method for 8B/10B and TMDS-encoded high-speed channels J Park, S Choi, JJ Kim, Y Kim, M Lee, H Kim, B Bae, H Song, K Cho, S Lee, ... IEEE Transactions on Electromagnetic Compatibility 60 (5), 1510-1519, 2017 | 14 | 2017 |
| Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5 D/3D Interconnects S Choi, H Kim, K Kim, J Park, DH Jung, J Kim Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 2139 …, 2017 | 13 | 2017 |
| High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package JK Hyesoo Kim, Jonghoon J. Kim, Junyong Park, Shinyoung Park, Sumin Choi ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (8 …, 2017 | 12 | 2017 |
| High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package JK Hyesoo Kim, Jonghoon J. Kim, Junyong Park, Shinyoung Park, Sumin Choi ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (8 …, 2017 | 12 | 2017 |
| A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation With N-Level (PAM-N) on Stacked Through-Silicon Vias J Park, DH Jung, B Kim, S Choi, Y Kim, S Park, G Park, K Cho, S Lee, ... IEEE Transactions on Electromagnetic Compatibility 61 (4), 1198-1206, 2018 | 11 | 2018 |
| An efficient crosstalk-included eye-diagram estimation method for high-speed interposer channel on 2.5-D and 3-D IC S Choi, H Kim, DH Jung, JJ Kim, J Lim, J Kim IEEE Transactions on Electromagnetic Compatibility 59 (3), 927-939, 2016 | 10 | 2016 |
| A compact on-interposer passive equalizer for chip-to-chip high-speed data transmission H Kim, J Cho, J Kim, K Kim, S Choi, J Kim, JS Pak 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging …, 2012 | 10 | 2012 |
| Eye-diagram estimation and analysis of High-Bandwidth Memory (HBM) interposer channel with crosstalk reduction schemes on 2.5 D and 3D IC S Choi, H Kim, DH Jung, JJ Kim, J Lim, H Lee, K Cho, J Kim 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016 | 8 | 2016 |
| Design and signal integrity analysis of high bandwidth memory (HBM) interposer in 2.5 D terabyte/s bandwidth graphics module H Lee, K Cho, H Kim, S Choi, J Lim, H Shim, J Kim Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 …, 2015 | 7 | 2015 |
| Crosstalk included eye diagram estimation of high-speed and wide I/O interposer channel for 2.5 D/3D IC S Choi, H Kim, K Kim, DH Jung, JJ Kim, J Lim, H Lee, J Kim, H Kim, Y Kim, ... 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging …, 2014 | 7 | 2014 |
