| Iron-facilitated dynamic active-site generation on spinel CoAl2O4 with self-termination of surface reconstruction for water oxidation T Wu, S Sun, J Song, S Xi, Y Du, B Chen, WA Sasangka, H Liao, CL Gan, ... Nature Catalysis 2 (9), 763-772, 2019 | 710 | 2019 |
| ZnS buffer layer for Cu2ZnSn (SSe) 4 monograin layer solar cell M Nguyen, K Ernits, KF Tai, CF Ng, SS Pramana, WA Sasangka, ... Solar Energy 111, 344-349, 2015 | 109 | 2015 |
| A review of silicon-based wafer bonding processes, an approach to realize the monolithic integration of Si-CMOS and III–V-on-Si wafers S Bao, Y Wang, K Lina, L Zhang, B Wang, WA Sasangka, KEK Lee, ... Journal of Semiconductors 42 (2), 023106, 2021 | 48 | 2021 |
| Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films CY Khoo, H Liu, WA Sasangka, RI Made, N Tamura, M Kunz, AS Budiman, ... Journal of materials science 51, 1864-1872, 2016 | 46 | 2016 |
| Influences of annealing on lithium-ion storage performance of thick germanium film anodes RA Susantyoko, X Wang, L Sun, W Sasangka, E Fitzgerald, Q Zhang Nano Energy 12, 521-527, 2015 | 43 | 2015 |
| Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation GJ Syaranamual, WA Sasangka, RI Made, S Arulkumaran, GI Ng, SC Foo, ... Microelectronics Reliability 64, 589-593, 2016 | 34 | 2016 |
| Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect SR Chun, WA Sasangka, MZ Ng, Q Liu, A Du, J Zhu, CM Ng, ZQ Liu, ... Small 9 (15), 2546-2552, 2013 | 26 | 2013 |
| Monolithic integration of Si-CMOS and III-V-on-Si through direct wafer bonding process KH Lee, Y Wang, B Wang, L Zhang, WA Sasangka, SC Goh, S Bao, ... IEEE Journal of the Electron Devices Society 6, 571-578, 2017 | 24 | 2017 |
| Ordered Mesoporous Alumina with Tunable Morphologies and Pore Sizes for CO2 Capture and Dye Separation GL Seah, L Wang, LF Tan, C Tipjanrawee, WA Sasangka, AK Usadi, ... ACS Applied Materials & Interfaces 13 (30), 36117-36129, 2021 | 22 | 2021 |
| Influence of substrate nitridation on the threading dislocation density of GaN grown on 200 mm Si (111) substrate A Kadir, S Srivastava, Z Li, KEK Lee, WA Sasangka, S Gradecak, SJ Chua, ... Thin Solid Films 663, 73-78, 2018 | 20 | 2018 |
| Threading dislocation movement in AlGaN/GaN-on-Si high electron mobility transistors under high temperature reverse bias stressing WA Sasangka, GJ Syaranamual, RI Made, CV Thompson, CL Gan AIP Advances 6 (9), 2016 | 20 | 2016 |
| Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing WA Sasangka, GJ Syaranamual, CL Gan, CV Thompson 2015 IEEE International Reliability Physics Symposium, 6C. 3.1-6C. 3.4, 2015 | 18 | 2015 |
| Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation WA Sasangka, GJ Syaranamual, Y Gao, RI Made, CL Gan, CV Thompson Microelectronics Reliability 76, 287-291, 2017 | 17 | 2017 |
| Characterisation of defects generated during constant current InGaN-on-silicon LED operation RI Made, Y Gao, GJ Syaranamual, WA Sasangka, L Zhang, XS Nguyen, ... Microelectronics Reliability 76, 561-565, 2017 | 16 | 2017 |
| Characterization of the Young’s modulus, residual stress and fracture strength of Cu–Sn–In thin films using combinatorial deposition and micro-cantilevers WA Sasangka, CL Gan, D Lai, CS Tan, CV Thompson Journal of Micromechanics and Microengineering 25 (3), 035023, 2015 | 16 | 2015 |
| Mesoporous titanium oxynitride monoliths from block copolymer-directed self-assembly of metal–urea additives Y Li, R Horia, WX Tan, N Larbaram, WA Sasangka, W Manalastas Jr, ... Langmuir 36 (36), 10803-10810, 2020 | 15 | 2020 |
| High-performance AlGaInP light-emitting diodes integrated on silicon through a superior quality germanium-on-insulator Y Wang, B Wang, WA Sasangka, S Bao, Y Zhang, HV Demir, J Michel, ... Photonics Research 6 (4), 290-295, 2018 | 11 | 2018 |
| High temperature performance study of gold wire bonding on a palladium bonding pad WA Sasangka, AC Tan 2006 8th Electronics Packaging Technology Conference, 330-335, 2006 | 11 | 2006 |
| Influence of bonding parameters on the interaction between Cu and noneutectic Sn-In solder thin films WA Sasangka, CL Gan, CV Thompson, WK Choi, J Wei Journal of electronic materials 40, 2329-2336, 2011 | 10 | 2011 |
| Iron-facilitated dynamic active-site generation on spinel CoAl2O4 with self-termination of surface reconstruction for water oxidation, Nat. Catal. 2 (2019) 763–772 T Wu, S Sun, J Song, S Xi, Y Du, B Chen, WA Sasangka, H Liao, CL Gan, ... | 9 | |
Chee Lip GanNanyang Technological University確認したメール アドレス: ntu.edu.sg
