| Health monitoring of lithium-ion batteries B Sood, C Hendricks, M Osterman, M Pecht EDFA Technical Articles 16 (2), 4-16, 2014 | 78 | 2014 |
| Disassembly methodology for conducting failure analysis on lithium–ion batteries N Williard, B Sood, M Osterman, M Pecht Journal of Materials Science: Materials in Electronics 22, 1616-1630, 2011 | 74 | 2011 |
| Laser-based technique for the transfer and embedding of electronic components and devices A Pique, SA Mathews, RCY Auyeung, BP Sood US Patent 8,056,222, 2011 | 63 | 2011 |
| Screening for counterfeit electronic parts B Sood, D Das, M Pecht Journal of Materials Science: Materials in Electronics 22, 1511-1522, 2011 | 50 | 2011 |
| Carbon footprinting of electronic products A Vasan, B Sood, M Pecht Applied energy 136, 636-648, 2014 | 42 | 2014 |
| Effect of lead-free soldering on key material properties of FR-4 printed circuit board laminates R Sanapala, B Sood, D Das, M Pecht IEEE Transactions on Electronics Packaging Manufacturing 32 (4), 272-280, 2009 | 33 | 2009 |
| Detection and reliability risks of counterfeit electrolytic capacitors A Shrivastava, MH Azarian, C Morillo, B Sood, M Pecht IEEE Transactions on Reliability 63 (2), 468-479, 2014 | 32 | 2014 |
| Tin whisker analysis of Toyota's electronic throttle controls B Sood, M Osterman, M Pecht Circuit World 37 (3), 4-9, 2011 | 31 | 2011 |
| Conductive filament formation in printed circuit boards: effects of reflow conditions and flame retardants B Sood, M Pecht Journal of Materials Science: Materials in Electronics 22, 1602-1615, 2011 | 22 | 2011 |
| Influence of molding compound on leakage current in MOS transistors MA Alam, D Das, MH Azarian, B Sood, MG Pecht IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (7 …, 2011 | 22 | 2011 |
| Comparison of printed circuit board property variations in response to simulated lead-free soldering B Sood, R Sanapala, D Das, M Pecht, CY Huang, MY Tsai IEEE Transactions on Electronics Packaging Manufacturing 33 (2), 98-111, 2010 | 21 | 2010 |
| Effect of moisture on thermal properties of halogen-free and halogenated printed-circuit-board laminates L Ma, B Sood, M Pecht IEEE Transactions on Device and Materials Reliability 11 (1), 66-75, 2011 | 20 | 2011 |
| The effect of epoxy/glass interfaces on CAF failures in printed circuit boards B Sood, M Pecht Microelectronics Reliability 82, 235-243, 2018 | 18 | 2018 |
| Evaluation of batteries for safe air transport N Williard, C Hendricks, B Sood, JS Chung, M Pecht Energies 9 (5), 340, 2016 | 17 | 2016 |
| Controlling moisture in printed circuit boards B Sood, M Pecht IPC Apex EXPO Proceedings, 2010 | 15 | 2010 |
| Systems, methods, and devices for health monitoring of an energy storage device S Bhanu, MG Pecht, MD Osterman US Patent 10,014,561, 2018 | 13 | 2018 |
| Thick film resistor failures A Shrivastava, A Amin, B Sood, M Azarian, M Pecht, M Zagami ISTFA 2008, 59-64, 2008 | 13 | 2008 |
| Root-Cause Failure Analysis of Electronics B Sood SMTA Philadelphia, 2013 | 12 | 2013 |
| Failure analyses of modern power semiconductor switching devices N Valentine, D Das, B Sood, M Pecht International Symposium on Microelectronics 2015 (1), 000690-000695, 2015 | 11 | 2015 |
| Risk-based safety and mission assurance: Approach and experiences in practice J Leitner, B Sood, E Isaac, J Shue, N Lindsey, J Plante Quality Engineering 30 (4), 648-662, 2018 | 8 | 2018 |
