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Youngwoo Kim
Youngwoo Kim
Assistant Professor, Sejong University
Verified email at sejong.ac.kr - Homepage
Title
Cited by
Cited by
Year
EMI reduction methods in wireless power transfer system for drone electrical charger using tightly coupled three-phase resonant magnetic field
C Song, H Kim, Y Kim, D Kim, S Jeong, Y Cho, S Lee, S Ahn, J Kim
IEEE Transactions on Industrial Electronics 65 (9), 6839-6849, 2018
1162018
Deep reinforcement learning-based optimal decoupling capacitor design method for silicon interposer-based 2.5-D/3-D ICs
H Park, J Park, S Kim, K Cho, D Lho, S Jeong, S Park, G Park, B Sim, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
572020
Through silicon via (TSV) defect modeling, measurement, and analysis
DH Jung, Y Kim, JJ Kim, H Kim, S Choi, YH Song, HC Bae, KS Choi, ...
IEEE transactions on components, packaging and manufacturing technology 7 (1 …, 2016
572016
Signal integrity design and analysis of silicon interposer for GPU-memory channels in high-bandwidth memory interface
K Cho, Y Kim, H Lee, H Kim, S Choi, J Song, S Kim, J Park, S Lee, J Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018
472018
Signal and power integrity analysis in 2.5 D integrated circuits (ICs) with glass, silicon and organic interposer
Y Kim, J Cho, K Kim, V Sundaram, R Tummala, J Kim
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 738-743, 2015
322015
Signal integrity design and analysis of differential high-speed serial links in silicon interposer with through-silicon via
K Cho, Y Kim, H Lee, J Song, J Park, S Lee, S Kim, G Park, K Son, J Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018
282018
Design optimization of high bandwidth memory (HBM) interposer considering signal integrity
K Cho, H Lee, H Kim, S Choi, Y Kim, J Lim, J Kim, H Kim, Y Kim, Y Kim
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2015
272015
Design and analysis of power distribution network (PDN) for high bandwidth memory (HBM) interposer in 2.5 D terabyte/s bandwidth graphics module
K Cho, Y Kim, H Lee, H Kim, S Choi, S Kim, J Kim
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 407-412, 2016
242016
Miniaturized bandpass filters as ultrathin 3-D IPDs and embedded thinfilms in 3-D glass modules
S Sitaraman, V Sukumaran, MR Pulugurtha, Z Wu, Y Suzuki, Y Kim, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017
232017
Fast and accurate power distribution network modeling of a silicon interposer for 2.5-D/3-D ICs with multiarray TSVs
K Cho, Y Kim, S Kim, H Park, J Park, S Lee, D Shim, K Lee, S Oh, J Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019
222019
Power distribution network design and optimization based on frequency dependent target impedance
Y Kim, K Kim, J Cho, J Kim, K Kang, T Yang, Y Ra, W Paik
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2015
222015
A frequency-selective EMI reduction method for tightly coupled wireless power transfer systems using resonant frequency control of a shielding coil in smartphone application
S Hong, Y Kim, S Lee, S Jeong, B Sim, H Kim, J Song, S Ahn, J Kim
IEEE Transactions on Electromagnetic Compatibility 61 (6), 2031-2039, 2019
212019
Highly-effective integrated EMI shields with graphene and nanomagnetic multilayered composites
AO Watanabe, S Jeong, S Kim, Y Kim, J Min, D Wong, MR Pulugurtha, ...
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 206-210, 2016
212016
Measurement and analysis of glass interposer power distribution network resonance effects on a high-speed through glass via channel
Y Kim, J Cho, JJ Kim, K Kim, K Cho, S Kim, S Sitaraman, V Sundaram, ...
IEEE Transactions on Electromagnetic Compatibility 58 (6), 1747-1759, 2016
202016
A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System
B Sim, S Jeong, Y Kim, S Park, S Lee, S Hong, J Song, H Kim, H Kang, ...
IEEE Transactions on Electromagnetic Compatibility 63 (3), 935-946, 2020
182020
Design and measurement of a novel on-interposer active power distribution network for efficient simultaneous switching noise suppression in 2.5-D/3-D IC
S Kim, Y Kim, K Cho, J Song, J Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (2 …, 2018
172018
Precise RLGC modeling and analysis of through glass via (TGV) for 2.5 D/3D IC
J Kim, I Hwang, Y Kim, J Cho, V Sundaram, R Tummala, J Kim
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 254-259, 2015
172015
Design of an on-interposer passive equalizer for high bandwidth memory (HBM) with 30Gbps data transmission
Y Jeon, H Kim, S Choi, Y Kim, J Kim
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2475-2480, 2016
162016
Analysis of power distribution network in glass, silicon interposer and PCB
Y Kim, K Kim, J Cho, J Kim, V Sundaram, R Tummala
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2014
162014
Power distribution network (PDN) design and analysis of a single and double-sided high bandwidth memory (HBM) interposer for 2.5 D terabtye/s bandwidth system
K Cho, Y Kim, S Kim, H Lee, S Choi, H Kim, J Kim
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 96-99, 2016
152016
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