フォロー
SivaChandra Jangam
SivaChandra Jangam
UCLA, Apple
確認したメール アドレス: g.ucla.edu
タイトル
引用先
引用先
Heterogeneous integration at fine pitch (≤ 10 µm) using thermal compression bonding
AA Bajwa, SC Jangam, S Pal, N Marathe, T Bai, T Fukushima, M Goorsky, ...
2017 IEEE 67th electronic components and technology conference (ECTC), 1276-1284, 2017
982017
Latency, bandwidth and power benefits of the superchips integration scheme
SC Jangam, S Pal, A Bajwa, S Pamarti, P Gupta, SS Iyer
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 86-94, 2017
532017
Electrical characterization of high performance fine pitch interconnects in silicon-interconnect fabric
SC Jangam, AA Bajwa, KK Thankkappan, P Kittur, SS Iyer
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1283-1288, 2018
462018
Flexible hybrid electronics technology using die-first FOWLP for high-performance and scalable heterogeneous system integration
T Fukushima, A Alam, A Hanna, SC Jangam, AA Bajwa, SS Iyer
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018
452018
Fine-pitch (≤ 10 µm) direct Cu-Cu interconnects using in-situ formic acid vapor treatment
SC Jangam, AA Bajwa, U Mogera, P Ambhore, T Colosimo, B Chylak, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 620-627, 2019
322019
Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems
SS Iyer, S Jangam, B Vaisband
IBM Journal of Research and Development 63 (6), 5: 1-5: 16, 2019
312019
Silicon-interconnect fabric for fine-pitch (≤ 10 μm) heterogeneous integration
SC Jangam, SS Iyer
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
282021
Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (< 6 µm) and Reliable Flexible Cu-Based …
A Hanna, A Alam, T Fukushima, S Moran, W Whitehead, SC Jangam, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1505-1511, 2018
262018
“FlexTrate^ TM”—Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP
T Fukushima, A Alam, Z Wan, SC Jangam, S Pal, G Ezhilarasu, A Bajwa, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 649-654, 2017
262017
Demonstration of a heterogeneously integrated system-on-wafer (SoW) assembly
AA Bajwa, SC Jangam, S Pal, B Vaisband, R Irwin, M Goorsky, SS Iyer
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1926-1930, 2018
222018
Demonstration of a Low Latency (< 20 ps) Fine-pitch (≤ 10 μm) Assembly on the Silicon Interconnect Fabric
SC Jangam, U Rathore, S Nagi, D Markovic, SS Iyer
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1801-1805, 2020
152020
Heterogeneous Integration on Silicon-Interconnect Fabric Using Fine-Pitch Interconnects (≤10 µm)
SC Jangam
University of California, Los Angeles, 2020
122020
A signaling figure of merit (s-FoM) for advanced packaging
SC Jangam, SS Iyer
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
92020
Design of a multi-layered QCA configurable logic block for FPGAs
B Ghosh, JS Chandra, A Salimath
Journal of Circuits, Systems and Computers 23 (06), 1450089, 2014
92014
Clocking scheme implementation for Multi-Layered quantum dot cellular automata design
JS Chandra, K Suresh, B Ghosh
Journal of Low Power Electronics 10 (2), 272-278, 2014
92014
Functional demonstration of< 0.4-pJ/bit, 9.8 μm fine-pitch dielet-to-dielet links for advanced packaging using silicon interconnect fabric
K Sahoo, U Rathore, SC Jangam, T Nguyen, D Markovic, SS Iyer
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2104-2110, 2022
42022
Integration and Characterization of InP Die on Silicon Interconnect Fabric
E Sorensen, B Vaisband, SC Jangam, T Shirley, SS Iyer
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 543-549, 2019
42019
Process development and material characterization of Cu-Cu thermo-compression bonding (TCB) for high-conductivity electrical interconnects.
A Bajwa, N Marathe, SC Jangam, S Pal, PY Liu, M Goorsky, SS Iyer
International Symposium on Microelectronics 2016 (1), 000203-000208, 2016
32016
Reliability Studies of Silicon Interconnect Fabric
N Shakoorzadeh, SC Jangam, K Rahim, P Ambhore, H Chien, A Hanna, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 800-805, 2019
22019
Simple Universal Parallel Interface (SuperCHIPS) Protocol for High Performance Heterogeneous System Integration
SC Jangam
University of California, Los Angeles, 2017
22017
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論文 1–20