| Intermetallic morphology and damage evolution under thermomechanical fatigue of lead (Pb)-free solder interconnections S Dunford, S Canumalla, P Viswanadharn 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 71 | 2004 |
| Reliability and failure analysis of lead-free solder joints M Meilunas, A Primavera, SO Dunford Proc. IPC Conf, 1-15, 2002 | 57 | 2002 |
| Method and apparatus for delivering therapeutic oxygen treatments JT Ross, SO Dunford US Patent App. 11/558,374, 2009 | 40 | 2009 |
| Power generating display device Z Radivojevic, J Rantala, S Dunford, V Puligandla, J Korppi-Tommola, ... US Patent App. 11/248,010, 2007 | 39 | 2007 |
| Influence of Au addition on the phase equilibria of near-eutectic Sn-3.8 Ag-0.7 Cu Pb-free solder alloy JY Park, R Kabade, CU Kim, T Carper, S Dunford, V Puligandla Journal of electronic materials 32, 1474-1482, 2003 | 37 | 2003 |
| Method for manufacturing a composite layer for an electronic device R Vatanparast, M Aarras, SO Dunford, T Fujii, J Lainonen, J Nousiainen, ... US Patent 7,523,546, 2009 | 35 | 2009 |
| Package level pre-applied underfills for thermo-mechanical reliability enhancements of electronic assemblies N Hannan, V Puligandla, S Dunford, P Rautila US Patent App. 10/134,879, 2002 | 25 | 2002 |
| Microstructural Evolution and Damage Mechanisms in Pb-free Solder Joints During Extended–40 to 125 C Thermal Cycles SO Dunford, A Primavera, M Meilunas Technical article, IPC review magazines, 8-9, 2002 | 20 | 2002 |
| Aging characteristics of green mold compound for use in encapsulation of microelectronic devices S Manoharan, C Patel, S Dunford, C Morillo, P McCluskey 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1768-1773, 2018 | 15 | 2018 |
| Method and apparatus for portable self contained re-breathing devices J Ross, S Dunford, K Kooiman, J Lansdown, K Vaughn, S Freeman, ... US Patent App. 11/623,727, 2007 | 15 | 2007 |
| Flexible optical illumination system R Cunningham, S Dunford, J Nousiainen, R Vatanparast US Patent App. 11/401,897, 2007 | 11 | 2007 |
| Lead-free solder alloys and methods of making same CU Kim, JY Park, R Kabade, T Carper, S Dunford, V Puligandla US Patent App. 10/678,655, 2004 | 11 | 2004 |
| Microstructural and performance implications of gold in Su-Ag-Cu-Sb interconnections W Peng, S Dunford, P Viswanadham, S Quander 53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003 | 10 | 2003 |
| Features-On The Road To Lead Free-Several studies report benefits of using lead-free solders, but certain technical issues must be considered before lead free can be … SO Dunford, P Viswanadham, P Rautila Circuits assembly 12 (4), 34-41, 2001 | 10 | 2001 |
| Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA) S Manoharan, C Patel, S Dunford, J Beshears, P McCluskey Microelectronics Reliability 99, 137-151, 2019 | 9 | 2019 |
| Composite layer for an electronic device R Vatanparast, M Aarras, SO Dunford, T Fujii, J Lainonen, J Nousiainen, ... US Patent 7,881,068, 2011 | 9 | 2011 |
| Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates KJ Lee, S Bhattacharya, M Varadarajan, L Wan, IR Abothu, V Sundaram, ... Proceedings. International Symposium on Advanced Packaging Materials …, 2005 | 9 | 2005 |
| Tacky Dots/sup TM/transfer of solder spheres for flip chip and electronic package applications G Hotchkiss, G Amador, L Jacobs, R Stierman, S Dunford, P Hundt, ... 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat …, 1998 | 9 | 1998 |
| Reliability of lead (Pb) free SAC solder interconnects with different PWB surface finishes under mechanical loading MM Hossain, F Zahedi, D Agonafer, P Viswanadham, SO Dunford Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 8 | 2006 |
| Metallurgical and reliability aspects of lead-free mixed technology electronic assembly for mobile communication products S Dunford, P Viswanadham, P Rautila IPC Works, 9-14, 2000 | 7 | 2000 |
