| A review on atomistic simulation of grain boundary behaviors in face-centered cubic metals L Zhang, C Lu, K Tieu Computational Materials Science 118, 180-191, 2016 | 114 | 2016 |
| Atomistic Simulation of Tensile Deformation Behavior of ∑5 Tilt Grain Boundaries in Copper Bicrystal L Zhang, C Lu, K Tieu Scientific reports 4, 5919, 2014 | 86 | 2014 |
| Inverse Hall-Petch relationship of high-entropy alloy by atomistic simulation L Zhang, Y Shibuta Materials Letters 274, 128024, 2020 | 72 | 2020 |
| Interaction between nano-voids and migrating grain boundary by molecular dynamics simulation L Zhang, Y Shibuta, C Lu, X Huang Acta Materialia 173, 206-224, 2019 | 60 | 2019 |
| Deformation mechanisms in nanotwinned copper by molecular dynamics simulation X Zhao, C Lu, AK Tieu, L Pei, L Zhang, L Su, L Zhan Materials Science and Engineering: A 687, 343-351, 2017 | 58 | 2017 |
| Strengthening mechanism and micropillar analysis of high-strength NiTi–Nb eutectic-type alloy prepared by laser powder bed fusion S Liu, S Han, L Zhang, LY Chen, L Wang, L Zhang, Y Tang, J Liu, H Tang, ... Composites Part B: Engineering 200, 108358, 2020 | 57 | 2020 |
| The shear response of copper bicrystals with Σ11 symmetric and asymmetric tilt grain boundaries by molecular dynamics simulation L Zhang, C Lu, K Tieu, X Zhao, L Pei Nanoscale 7 (16), 7224-7233, 2015 | 56 | 2015 |
| Grain boundary induced deformation mechanisms in nanocrystalline Al by molecular dynamics simulation: From interatomic potential perspective L Zhang, Y Shibuta, X Huang, C Lu, M Liu Computational Materials Science 156, 421-433, 2019 | 52 | 2019 |
| Brittle versus ductile behaviour of nanotwinned copper: a molecular dynamics study L Pei, C Lu, X Zhao, L Zhang, K Cheng, G Michal, K Tieu Acta Materialia 89, 1-13, 2015 | 46 | 2015 |
| Dynamic interaction between grain boundary and stacking fault tetrahedron L Zhang, C Lu, K Tieu, Y Shibuta Scripta Materialia 144, 78-83, 2018 | 44 | 2018 |
| Theoretical and experimental investigation of thermal and oxidation behaviours of a high speed steel work roll during hot rolling GY Deng, HT Zhu, AK Tieu, LH Su, M Reid, L Zhang, PT Wei, X Zhao, ... International Journal of Mechanical Sciences 131, 811-826, 2017 | 44 | 2017 |
| The formation and destruction of stacking fault tetrahedron in fcc metals: A molecular dynamics study L Zhang, C Lu, G Michal, G Deng, K Tieu Scripta Materialia 136, 78-82, 2017 | 43 | 2017 |
| Coupled grain boundary motion in aluminium: the effect of structural multiplicity K Cheng*, L Zhang*, C Lu, K Tieu Scientific reports 6, 25427, 2016 | 42 | 2016 |
| Effect of high pressure torsion process on the microhardness, microstructure and tribological property of Ti6Al4V alloy G Deng, X Zhao, L Su, P Wei, L Zhang, L Zhan, Y Chong, H Zhu, N Tsuji Journal of Materials Science & Technology 94, 183-195, 2021 | 41 | 2021 |
| Stacking fault tetrahedron induced plasticity in copper single crystal L Zhang, C Lu, K Tieu, L Su, X Zhao, L Pei Materials Science and Engineering: A 680, 27-38, 2017 | 37 | 2017 |
| Molecular dynamics simulation and machine learning of mechanical response in non-equiatomic FeCrNiCoMn high-entropy alloy L Zhang, K Qian, J Huang, M Liu, Y Shibuta Journal of Materials Research and Technology 13, 2043-2054, 2021 | 34 | 2021 |
| Molecular dynamics study on the grain boundary dislocation source in nanocrystalline copper under tensile loading L Zhang, C Lu, K Tieu, L Pei, X Zhao, K Cheng Materials Research Express 2 (3), 035009, 2015 | 32 | 2015 |
| Molecular dynamics study on the atomic mechanisms of coupling motion of [0 0 1] symmetric tilt grain boundaries in copper bicrystal L Zhang, C Lu, G Michal, K Tieu, K Cheng Materials Research Express 1 (1), 015019, 2014 | 32 | 2014 |
| Prediction on mechanical properties of non-equiatomic high-entropy alloy by atomistic simulation and machine learning L Zhang, K Qian, BW Schuller, Y Shibuta Metals 11 (6), 922, 2021 | 28 | 2021 |
| Strengthening mechanisms and dislocation processes in< 111> textured nanotwinned copper X Zhao, C Lu, AK Tieu, L Pei, L Zhang, K Cheng, M Huang Materials Science and Engineering: A 676, 474-486, 2016 | 28 | 2016 |
Xing ZhaoCentral South University確認したメール アドレス: csu.edu.cn
