フォロー
Ankur Agarwal
Ankur Agarwal
Maharashtra Knowledge Corporation Limited (Business Analyst)
確認したメール アドレス: mkcl.org
タイトル
引用先
引用先
Dual mode inductively coupled plasma reactor with adjustable phase coil assembly
S Banna, VN Todorow, KS Collins, A Nguyen, MJ Salinas, Z Chen, ...
US Patent App. 12/821,636, 2011
4782011
Fast atomic layer etch process using an electron beam
A Agarwal, S Rauf, K Ramaswamy
US Patent 9,362,131, 2016
2342016
Plasma atomic layer etching using conventional plasma equipment
A Agarwal, MJ Kushner
Journal of Vacuum Science & Technology A 27 (1), 37-50, 2009
2022009
Pulsed high-density plasmas for advanced dry etching processes
S Banna, A Agarwal, G Cunge, M Darnon, E Pargon, O Joubert
Journal of Vacuum Science & Technology A 30 (4), 2012
1932012
Pulsed plasma high aspect ratio dielectric process
A Agarwal, KS Collins, S Rauf, K Ramaswamy, TB Lill
US Patent 8,382,999, 2013
1502013
Synchronized radio frequency pulsing for plasma etching
B Liao, K Kawasaki, Y Pattar, SF Shoji, DD Nguyen, K Ramaswamy, ...
US Patent 8,962,488, 2015
1362015
Inductively coupled pulsed plasmas in the presence of synchronous pulsed substrate bias for robust, reliable, and fine conductor etching
S Banna, A Agarwal, K Tokashiki, H Cho, S Rauf, V Todorow, ...
IEEE Transactions on Plasma Science 37 (9), 1730-1746, 2009
1112009
Effect of cell size and shape on single-cell electroporation
A Agarwal, I Zudans, EA Weber, J Olofsson, O Orwar, SG Weber
Analytical chemistry 79 (10), 3589-3596, 2007
1112007
Synchronized radio frequency pulsing for plasma etching
B Liao, K Kawasaki, Y Pattar, SF Shoji, DD Nguyen, K Ramaswamy, ...
US Patent 8,404,598, 2013
1022013
Apparatus for radial delivery of gas to a chamber and methods of use thereof
JA Lee, MJ Salinas, A Agarwal, ER Gold, JP Cruse, A Pal, A Nguyen
US Patent 8,562,742, 2013
972013
Effect of simultaneous source and bias pulsing in inductively coupled plasma etching
A Agarwal, PJ Stout, S Banna, S Rauf, K Tokashiki, JY Lee, K Collins
Journal of Applied Physics 106 (10), 2009
672009
Effect of nonsinusoidal bias waveforms on ion energy distributions and fluorocarbon plasma etch selectivity
A Agarwal, MJ Kushner
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 23 (5 …, 2005
642005
QDB: a new database of plasma chemistries and reactions
J Tennyson, S Rahimi, C Hill, L Tse, A Vibhakar, D Akello-Egwel, ...
Plasma Sources Science and Technology 26 (5), 055014, 2017
632017
Seasoning of plasma etching reactors: Ion energy distributions to walls and real-time and run-to-run control strategies
A Agarwal, MJ Kushner
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 26 (3 …, 2008
532008
Efficient AI system design with cross-layer approximate computing
S Venkataramani, X Sun, N Wang, CY Chen, J Choi, M Kang, A Agarwal, ...
Proceedings of the IEEE 108 (12), 2232-2250, 2020
462020
Numerical calculations of single-cell electroporation with an electrolyte-filled capillary
I Zudans, A Agarwal, O Orwar, SG Weber
Biophysical journal 92 (10), 3696-3705, 2007
432007
Synchronous pulse plasma operation upon source and bias radio frequencys for inductively coupled plasma for highly reliable gate etching technology
K Tokashiki, H Cho, S Banna, JY Lee, K Shin, V Todorow, WS Kim, ...
Japanese journal of applied physics 48 (8S1), 08HD01, 2009
412009
Gas heating mechanisms in capacitively coupled plasmas
A Agarwal, S Rauf, K Collins
Plasma Sources Science and Technology 21 (5), 055012, 2012
392012
Extraction of negative ions from pulsed electronegative capacitively coupled plasmas
A Agarwal, S Rauf, K Collins
Journal of Applied Physics 112 (3), 2012
372012
Etching with atomic precision by using low electron temperature plasma
L Dorf, JC Wang, S Rauf, GA Monroy, Y Zhang, A Agarwal, J Kenney, ...
Journal of Physics D: Applied Physics 50 (27), 274003, 2017
342017
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