| Analysis and design of inductive coupling and transceiver circuit for inductive inter-chip wireless superconnect N Miura, D Mizoguchi, T Sakurai, T Kuroda IEEE Journal of Solid-State Circuits 40 (4), 829-837, 2005 | 170 | 2005 |
| A 1.2 Gb/s/pin wireless superconnect based on inductive inter-chip signaling (IIS) D Mizoguchi, YB Yusof, N Miura, T Sakura, T Kuroda 2004 IEEE International Solid-State Circuits Conference (IEEE Cat. No …, 2004 | 140 | 2004 |
| A 0.14 pJ/b inductive-coupling inter-chip data transceiver with digitally-controlled precise pulse shaping N Miura, H Ishikuro, T Sakurai, T Kuroda 2007 IEEE International Solid-State Circuits Conference. Digest of Technical …, 2007 | 133 | 2007 |
| A 1Tb/s 3W inductive-coupling transceiver for inter-chip clock and data link N Miura, D Mizoguchi, M Inoue, K Niitsu, Y Nakagawa, M Tago, ... 2006 IEEE International Solid State Circuits Conference-Digest of Technical …, 2006 | 132 | 2006 |
| A scalable 3D heterogeneous multi-core processor with inductive-coupling ThruChip interface N Miura, Y Koizumi, E Sasaki, Y Take, H Matsutani, T Kuroda, H Amano, ... Cool Chips XVI (COOL Chips), 2013 IEEE, 1-3, 2013 | 124 | 2013 |
| A 195-Gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package N Miura, D Mizoguchi, M Inoue, T Sakurai, T Kuroda IEEE Journal of Solid-State Circuits 41 (1), 23-34, 2005 | 96 | 2005 |
| An 11Gb/s inductive-coupling link with burst transmission N Miura, Y Kohama, Y Sugimori, H Ishikuro, T Sakurai, T Kuroda 2008 IEEE International Solid-State Circuits Conference-Digest of Technical …, 2008 | 94 | 2008 |
| A 1 Tb/s 3 W inductive-coupling transceiver for 3D-stacked inter-chip clock and data link N Miura, D Mizoguchi, M Inoue, K Niitsu, Y Nakagawa, M Tago, ... IEEE Journal of Solid-State Circuits 42 (1), 111-122, 2006 | 76 | 2006 |
| A 195Gb/s 1.2 W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme N Miura, D Mizoguchi, M Inoue, H Tsuji, T Sakurai, T Kuroda ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State …, 2005 | 75 | 2005 |
| A high-speed inductive-coupling link with burst transmission N Miura, Y Kohama, Y Sugimori, H Ishikuro, T Sakurai, T Kuroda IEEE Journal of Solid-State Circuits 44 (3), 947-955, 2009 | 73 | 2009 |
| Electronic circuit T Kuroda, D Mizoguchi, YB Yusof, N Miura, T Sakurai US Patent 7,768,790, 2010 | 63 | 2010 |
| Ultraviolet sensor and method of manufacturing ultraviolet sensor N Miura US Patent App. 12/343,907, 2009 | 62 | 2009 |
| 6W/25mm2 inductive power transfer for non-contact wafer-level testing A Radecki, H Chung, Y Yoshida, N Miura, T Shidei, H Ishikuro, T Kuroda 2011 IEEE International Solid-State Circuits Conference, 230-232, 2011 | 55 | 2011 |
| An 8tb/s 1pj/b 0.8mm2/tb/s qdr inductive-coupling interface between 65nm cmos gpu and 0.1μm dram N Miura, K Kasuga, M Saito, T Kuroda 2010 IEEE International Solid-State Circuits Conference-(ISSCC), 436-437, 2010 | 52 | 2010 |
| A scalable 3D heterogeneous multicore with an inductive ThruChip interface N Miura, Y Koizumi, Y Take, H Matsutani, T Kuroda, H Amano, ... IEEE Micro 33 (6), 6-15, 2013 | 51 | 2013 |
| Cross talk countermeasures in inductive inter-chip wireless superconnect N Miura, D Mizoguchi, T Sakurai, T Kuroda Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat …, 2004 | 51 | 2004 |
| Em attack is non-invasive?-design methodology and validity verification of em attack sensor N Homma, Y Hayashi, N Miura, D Fujimoto, D Tanaka, M Nagata, T Aoki International Workshop on Cryptographic Hardware and Embedded Systems, 1-16, 2014 | 43 | 2014 |
| Wideband inductive-coupling interface for high-performance portable system H Ishikuro, N Miura, T Kuroda 2007 IEEE Custom Integrated Circuits Conference, 13-20, 2007 | 41 | 2007 |
| Analysis and design of transceiver circuit and inductor layout for inductive inter-chip wireless superconnect N Miura, D Mizoguchi, YB Yusof, T Sakurai, T Kuroda 2004 Symposium on VLSI Circuits. Digest of Technical Papers (IEEE Cat. No …, 2004 | 40 | 2004 |
| A 2Gb/s 1.8 pJ/b/chip inductive-coupling through-chip bus for 128-Die NAND-flash memory stacking M Saito, N Miura, T Kuroda 2010 IEEE International Solid-State Circuits Conference-(ISSCC), 440-441, 2010 | 39 | 2010 |
Tadahiro KurodaKeio UniversityVerified email at kuroda.elec.keio.ac.jp
