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NG Tsz-WaiCity University of Hong KongVerified email at cityu.edu.hk
Lo Ming-FaiCity University of Hong KongVerified email at cityu.edu.hk
Xiaoke Liu (Xiao-Ke Liu)Associate Professor at Linköping UniversityVerified email at liu.se
Lin-Bao Luo (罗林保)Hefei University of Technology (合肥工业大学微电子学院教授)Verified email at hfut.edu.cn
Ziruo Hong (洪自若)Apple IncVerified email at ucla.edu
Yeshayahu LifshitzAlfred and Marion Bar Chair of Engineering, Dept. of Materials Science and Engineering, TechnionVerified email at tx.technion.ac.il
Ruiqin ZHANGCity University of Hong KongVerified email at cityu.edu.hk
Dapeng YUProfessor of Condensed Matter Physics and Materials Science, Peking UniversityVerified email at pku.edu.cn
Sui-Dong WangProfessor, Institute of Functional Nano & Soft Materials (FUNSOM),Soochow UniversityVerified email at suda.edu.cn
Yuan YaoInstitute of Physics, Chinese Academy of ScienceVerified email at iphy.ac.cn
Shafiq.ICity University of Hong KongVerified email at my.cityu.edu.hk
W.J. ZhangProfessor of Mechanical Engineering and Biomedical Engineering, University of SaskatchewanVerified email at usask.ca
Zhengwei PanKing Fahd University of Petroleum and Minerals