| A 96-MB 3D-stacked SRAM using inductive coupling with 0.4-V transmitter, termination scheme and 12: 1 SerDes in 40-nm CMOS K Shiba, T Omori, K Ueyoshi, S Takamaeda-Yamazaki, M Motomura, ... IEEE Transactions on Circuits and Systems I: Regular Papers 68 (2), 692-703, 2020 | 23 | 2020 |
| A 7-nm FinFET 1.2-TB/s/mm2 3D-Stacked SRAM Module With 0.7-pJ/b Inductive Coupling Interface Using Over-SRAM Coil and Manchester-Encoded Synchronous … K Shiba, M Okada, A Kosuge, M Hamada, T Kuroda IEEE Journal of Solid-State Circuits 58 (7), 2075-2086, 2022 | 11 | 2022 |
| A 183.4 nJ/inference 152.8 μW Single-Chip Fully Synthesizable Wired-Logic DNN Processor for Always-On 35 Voice Commands Recognition Application A Kosuge, R Sumikawa, YC Hsu, K Shiba, M Hamada, T Kuroda 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2023 | 7 | 2023 |
| A 13.7 μJ/prediction 88% Accuracy CIFAR-10 Single-Chip Wired-logic Processor in 16-nm FPGA using Non-Linear Neural Network YC Hsu, A Kosuge, R Sumikawa, K Shiba, M Hamada, T Kuroda 2022 IEEE Hot Chips 34 Symposium (HCS), 1-14, 2022 | 5 | 2022 |
| A 7-nm FinFET 1.2-TB/s/mm2 3D-Stacked SRAM with an Inductive Coupling Interface Using Over-SRAM Coils and Manchester-Encoded Synchronous Transceivers K Shiba, M Okada, A Kosuge, M Hamada, T Kuroda 2022 IEEE Hot Chips 34 Symposium (HCS), 1-14, 2022 | 5 | 2022 |
| A 3D-stacked SRAM using inductive coupling with low-voltage transmitter and 12: 1 SerDes K Shiba, T Omori, K Ueyoshi, K Ando, K Hirose, S Takamaeda-Yamazaki, ... 2020 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2020 | 5 | 2020 |
| 3D system-on-a-chip design with through-silicon-via-less power supply using highly doped silicon via K Shiba, M Hamada, T Kuroda Japanese Journal of Applied Physics 59 (SG), SGGL04, 2020 | 5 | 2020 |
| A 3D-Stacked SRAM Using Inductive Coupling Technology for AI Inference Accelerator in 40-nm CMOS K Shiba, T Omori, M Hamada, T Kuroda Proceedings of the 26th Asia and South Pacific Design Automation Conference …, 2021 | 4 | 2021 |
| A Fully Synthesized 13.7 μJ/prediction 88% Accuracy CIFAR-10 Single-Chip Data-Reusing Wired-Logic Processor Using Non-Linear Neural Network YC Hsu, A Kosuge, R Sumikawa, K Shiba, M Hamada, T Kuroda Proceedings of the 28th Asia and South Pacific Design Automation Conference …, 2023 | 3 | 2023 |
| A 12.8-Gb/s 0.5-pJ/b Encoding-Less Inductive Coupling Interface Achieving 111-GB/s/W 3D-Stacked SRAM in 7-nm FinFET K Shiba, M Okada, A Kosuge, M Hamada, T Kuroda IEEE Solid-State Circuits Letters 6, 65-68, 2023 | 2 | 2023 |
| A 1.2nJ/Classification 2.4mm2 Wired-Logic Neuron Cell Array Using Logically Compressed Non-Linear Function Blocks in 0.18undefinedm CMOS R Sumikawa, K Shiba, A Kosuge, M Hamada, T Kuroda Extended Abstracts of the 2022 International Conference on Solid State …, 2022 | 2 | 2022 |
| Polyomino: A 3D-SRAM-Centric Architecture for Randomly Pruned Matrix Multiplication with Simple Rearrangement Algorithm and x0. 37 Compression Format K Shiba, M Okada, A Kosuge, M Hamada, T Kuroda 2022 20th IEEE Interregional NEWCAS Conference (NEWCAS), 99-103, 2022 | 2 | 2022 |
| A 5-GHz 0.15-mm2 Collision Avoidable RFID Employing Complementary Pass-transistor Adiabatic Logic with an Inductively Connected External Antenna S Shibata, R Miura, Y Sawabe, K Shiba, A Kosuge, M Hamada, T Kuroda 2021 IEEE Asian Solid-State Circuits Conference (A-SSCC), 1-3, 2021 | 2 | 2021 |
| 3D SoC design with TSV-less power supply employing highly doped silicon via K Shiba, M Hamada, T Kuroda Proc. JSAP Int. Conf. Solid State Devices Mater., 515-516, 2019 | 2 | 2019 |
| 1.2 nJ/classification 2.4 mm2 asynchronous wired-logic DNN processor using synthesized nonlinear function blocks in 0.18 μm CMOS R Sumikawa, K Shiba, A Kosuge, M Hamada, T Kuroda Japanese Journal of Applied Physics 62 (SC), SC1019, 2023 | 1 | 2023 |
| A 5-GHz 0.15-mm² Collision-Avoiding RFID Employing Complementary Pass-Transistor Adiabatic Logic With an Inductively Connected External Antenna in 0.18-μm CMOS S Shibata, R Miura, Y Sawabe, K Shiba, A Kosuge, M Hamada, T Kuroda IEEE Solid-State Circuits Letters 5, 268-271, 2022 | 1 | 2022 |
| A 12.8-Gbps 0.5-pJ/b Encoding-less Inductive Coupling Interface Using Clocked Hysteresis Comparator for 3D-stacked SRAM in 7-nm FinFET K Shiba, M Okada, A Kosuge, M Hamada, T Kuroda 2022 IEEE Asian Solid-State Circuits Conference (A-SSCC), 1-3, 2022 | 1 | 2022 |
| A Low-power RFID with 100kbps Data Rate Employing High-speed Power Clock Generator for Complementary Pass-transistor Adiabatic Logic S Shibata, Y Sawabe, K Shiba, A Kosuge, M Hamada, T Kuroda 2022 29th IEEE International Conference on Electronics, Circuits and Systems …, 2022 | 1 | 2022 |
| A bonding-less 5 GHz RFID module using inductive coupling between IC and antenna R Miura, S Shibata, M Usui, K Shiba, A Kosuge, M Hamada, T Kuroda Japanese Journal of Applied Physics 61 (SC), SC1058, 2022 | 1 | 2022 |
| Crosstalk analysis and countermeasures of high-density multi-hop inductive coupling interface for 3D-stacked memory K Shiba, T Omori, M Okada, M Hamada, T Kuroda 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 1 | 2020 |
Tadahiro KurodaProfessor of EECS, The University of TokyoVerified email at g.ecc.u-tokyo.ac.jp
