| Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting MS Al Farisi, H Hirano, J Frömel, S Tanaka Journal of Micromechanics and Microengineering 27 (1), 015029, 2016 | 47 | 2016 |
| Aluminum Patterned Electroplating from AlCl3–[EMIm]Cl Ionic Liquid towards Microsystems Application MS Al Farisi, S Hertel, M Wiemer, T Otto Micromachines 9 (11), 589, 2018 | 28 | 2018 |
| Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging MS Al Farisi, H Hirano, S Tanaka Sensors and Actuators A: Physical 279, 671-679, 2018 | 23 | 2018 |
| Advancements in MEMS technology for medical applications: Microneedles and miniaturized sensors M Shikida, Y Hasegawa, MS Al Farisi, M Matsushima, T Kawabe Japanese Journal of Applied Physics 61 (SA), SA0803, 2021 | 13 | 2021 |
| Tailoring material properties of electrochemically deposited Al film from chloroaluminate ionic liquid for microsystem technology using pulsed deposition MS Al Farisi, T Tsukamoto, S Tanaka Sensors and Actuators A: Physical 316, 112384, 2020 | 7 | 2020 |
| Fabrication method of micromachined quartz glass resonator using sacrificial supporting structures MJ Khan, T Tsukamoto, MS Al Farisi, S Tanaka Sensors and Actuators A: Physical 305, 111922, 2020 | 7 | 2020 |
| Zero-balance method for evaluation of sealed cavity pressure down to single digit pa using thin silicon diaphragm MS Al Farisi, H Hirano, S Tanaka Journal of Microelectromechanical Systems 29 (3), 418-426, 2020 | 6 | 2020 |
| Roll/pitch rate integrating mems gyroscope using dynamically balanced dual-mass resonator S Wang, MS Al Farisi, T Tsukamoto, S Tanaka 2020 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL …, 2020 | 5 | 2020 |
| Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application MS Al Farisi, S Hertel, M Wiemer, T Otto 2018 International Conference on Electronics Packaging and iMAPS All Asia …, 2018 | 5 | 2018 |
| Facile in-tube-center packaging of flexible airflow rate microsensor for simultaneous respiration and heartbeat measurement MS Al Farisi, Y Wang, Y Hasegawa, M Matsushima, T Kawabe, M Shikida IEEE Sensors Journal, 2023 | 3 | 2023 |
| Sensitivity enhancement of tube-integrated MEMS flow sensor using flexible copper on polyimide substrate T Tsukada, R Takigawa, Y Hasegawa, MS Al Farisi, M Shikida Micromachines 14 (1), 42, 2022 | 3 | 2022 |
| Electroplated Al press marking for wafer-level bonding MS Al Farisi, T Tsukamoto, S Tanaka Micromachines 13 (8), 1221, 2022 | 3 | 2022 |
| Mechanical hardening of electrochemically deposited aluminum from chloroaluminate ionic liquid MS Al Farisi, T Tsukamoto, S Tanaka Scripta Materialia 213, 114599, 2022 | 3 | 2022 |
| Fully CMOS-Compatible Wafer Bonding Based on Press Marking Using Thick Electroplated Aluminum MS Al Farisi, T Tsukamoto, S Tanaka 2021 21st International Conference on Solid-State Sensors, Actuators and …, 2021 | 3 | 2021 |
| Dual-mass resonator with dynamically balanced structure for roll/pitch rate integrating gyroscope S Wang, MS Al Farisi, J Chen, T Tsukamoto, S Tanaka 2021 IEEE Sensors, 1-4, 2021 | 2 | 2021 |
| Evaluation of the Disaster Mitigation Action Card Game for International Students in Japan R Kaneko, MSA Farisi, S Yamada, M Kuri 東北地域災害科学研究= Tohoku journal of natural disaster science 54, 279-284, 2018 | 2 | 2018 |
| 250° C wafer-level vacuum sealing using electroplated copper bonding frame planarized by fly-cutting MS Al Farisi, K Tanaka, H Hirano, S Tanaka 2017 19th International Conference on Solid-State Sensors, Actuators and …, 2017 | 2 | 2017 |
| Facile Packaging for Fiber-Shaped Flexible MEMS Thermal Accelerometer MS Al Farisi, Y Wang, Y Hasegawa, M Shikida IEEE Sensors Letters, 2023 | 1 | 2023 |
| Analysis of Airstream Inside the Slip Joint of Tracheal Intubation Tube for Breathing Measurement T Tsukada, Y Hasegawa, MS Al Farisi, M Matsushima, T Kawabe, ... IEEJ Transactions on Sensors and Micromachines 143 (1), 6-12, 2023 | 1 | 2023 |
| Electrochemically Deposited Aluminum for MEMS Thermal Actuator MS Al Farisi, T Tsukamoto, S Tanaka 2021 Smart Systems Integration (SSI), 1-4, 2021 | 1 | 2021 |
Shuji TanakaTohoku UniversityVerified email at mems.mech.tohoku.ac.jp
