| Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias M Murugesan, H Kino, H Nohira, JC Bea, A Horibe, F Yamada, ... 2010 International Electron Devices Meeting, 2.3. 1-2.3. 4, 2010 | 117 | 2010 |
| Tandem lighting panel E Higuchi, T Ishikawa, A Horibe US Patent 6,241,358, 2001 | 109 | 2001 |
| Full intermetallic joints for chip stacking by using thermal gradient bonding TL Yang, T Aoki, K Matsumoto, K Toriyama, A Horibe, H Mori, Y Orii, ... Acta Materialia 113, 90-97, 2016 | 81 | 2016 |
| High-bandwidth, high-numerical aperture graded-index polymer optical fiber T Ishigure, A Horibe, E Nihei, Y Koike Journal of lightwave technology 13 (8), 1686-1691, 1995 | 64 | 1995 |
| Light source device with uniformity in color temperature of emission Y Koike, A Horibe US Patent 6,217,184, 2001 | 35 | 2001 |
| Liquid crystal display device and display device A Horibe, M Suzuki, T Fujita, N Kushida US Patent 6,765,634, 2004 | 34 | 2004 |
| Inter chip fill for 3D chip stack A Horibe, F Yamada, C Feger, K JU Transactions of The Japan Institute of Electronics Packaging 2 (1), 160-162, 2009 | 30 | 2009 |
| Brighter backlights using highly scattered optical‐transmission polymer A Horibe, M Izhuara, E Nihei, Y Koike Journal of the Society for Information Display 3 (4), 169-171, 1995 | 26 | 1995 |
| Through silicon via process for effective multi-wafer integration A Horibe, K Sueoka, T Aoki, K Toriyama, K Okamoto, S Kohara, H Mori, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1808-1812, 2015 | 22 | 2015 |
| Alignment method for circular multi-core optical fiber A Horibe, F Yamada, Y Taira US Patent 7,548,674, 2009 | 20 | 2009 |
| Single-mode polymer waveguide connector assembly A Horibe, H Numata US Patent 10,107,966, 2018 | 19 | 2018 |
| High-efficiency and high-quality LCD backlight using highly scattering optical transmission polymer A Horibe, M Baba, E NIHEI, Y Koike IEICE transactions on electronics 81 (11), 1697-1702, 1998 | 18 | 1998 |
| High efficiency and high visual quality LCD backlighting system A Horibe, M Baba, E Nihei, Y Koike SID Symposium Digest of Technical Papers 29 (1), 153-156, 1998 | 17 | 1998 |
| No clean flux technology for large die flip chip packages A Horibe, KW Lee, K Okamoto, H Mori, Y Orii, Y Nishizako, O Suzuki, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 688-693, 2013 | 14 | 2013 |
| High bandwidth and high numerical aperture graded-index polymer optical fibre T Ishigure, A Horibe, E Nihei, Y Koike Electronics Letters 30 (14), 1169-1171, 1994 | 13 | 1994 |
| CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration R Miyazawa, C Marushima, T Aoki, A Horibe, T Hisada 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1050-1056, 2021 | 11 | 2021 |
| TSV diagnostics by X-ray microscopy K Sueoka, F Yamada, A Horibe, H Kikuchi, K Minami, Y Orii 2011 IEEE 13th Electronics Packaging Technology Conference, 695-698, 2011 | 11 | 2011 |
| High-density interconnecting adhesive tape A Horibe, H Mori, K Okamoto US Patent 10,529,665, 2020 | 10 | 2020 |
| Effect of underfill properties on thermomechanical stress in fine pitch 3D-IC package A Horibe, S Kohara, K Sueoka, K Matsumoto, Y Orii, F Yamada Proceedings of ICEP-IAAC 2012, 11-16, 2012 | 10 | 2012 |
| Characterization of non-conductive paste materials (NCP) for thermocompression bonding in a direct bonded heterogeneously integrated (DBHi) Si-bridge package A Horibe, T Watanabe, C Marushima, H Mori, S Kohara, R Yu, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 625-630, 2022 | 9 | 2022 |
Keishi OkamotoIBM Research - Tokyo確認したメール アドレス: jp.ibm.com
