Stephan Schoenfelder
Stephan Schoenfelder
Other namesStephan Schönfelder
Professor, Leipzig University of Applied Sciences
Verified email at - Homepage
Cited by
Cited by
Investigations of the influence of dicing techniques on the strength properties of thin silicon
S Schoenfelder, M Ebert, C Landesberger, K Bock, J Bagdahn
Microelectronics reliability 47 (2-3), 168-178, 2007
Infrared birefringence imaging of residual stress and bulk defects in multicrystalline silicon
V Ganapati, S Schoenfelder, S Castellanos, S Oener, R Koepge, ...
Journal of Applied Physics 108 (6), 2010
Modeling and testing the mechanical strength of solar cells
F Kaule, W Wang, S Schoenfelder
Solar energy materials and solar cells 120, 441-447, 2014
Microcracks in silicon wafers I: Inline detection and implications of crack morphology on wafer strength
M Demant, T Welschehold, M Oswald, S Bartsch, T Brox, S Schoenfelder, ...
IEEE Journal of Photovoltaics 6 (1), 126-135, 2015
High quality half-cell processing using thermal laser separation
S Eiternick, F Kaule, HU Zühlke, T Kießling, M Grimm, S Schoenfelder, ...
Energy Procedia 77, 340-345, 2015
Detection and analysis of micro-cracks in multi-crystalline silicon wafers during solar cell production
M Demant, S Rein, J Krisch, S Schoenfelder, C Fischer, S Bartsch, R Preu
2011 37th IEEE Photovoltaic Specialists Conference, 001641-001646, 2011
Loss of wire tension in the wire web during the slurry based multi wire sawing process
D Meißner, S Schoenfelder, B Hurka, J Zeh, K Sunder, R Koepge, ...
Solar energy materials and solar cells 120, 346-355, 2014
Comparison of test methods for strength characterization of thin solar wafer
S Schoenfelder, A Bohne, J Bagdahn
Proceedings of the 22nd European Photovoltaic Solar Energy Conference 1 …, 2007
Mechanical damage of half-cell cutting technologies in solar cells and module laminates
F Kaule, M Pander, M Turek, M Grimm, E Hofmueller, S Schoenfelder
AIP Conference Proceedings 1999 (1), 2018
Solar module with half size solar cells
J Schneider, S Schoenfelder, S Dietrich, M Turek
29th EUPVSEC, Amsterdam, 185, 2014
Experimental and numerical analysis of scratching induced damage during diamond wire sawing of silicon
F Wallburg, M Kuna, M Budnitzki, S Schoenfelder
Wear 454, 203328, 2020
Micro-cracks in silicon wafers and solar cells: detection and rating of mechanical strength and electrical quality
M Demant, M Oswald, T Welschehold, S Nold, S Bartsch, S Schoenfelder, ...
Proceedings of the 29th Solar Energy Conference and Exhibition, 390-396, 2014
Mechanical characterisation and modelling of thin chips
S Schoenfelder, J Bagdahn, M Petzold
Ultra-Thin Chip Technology and Applications, 195-218, 2011
The influence of transport operations on the wafer strength and breakage rate
R Koepge, S Schoenfelder, T Giesen, C Fischmann, A Verl, J Bagdahn
Evaluation of silicon solar cell separation techniques for advanced module concepts
M Oswald, M Turek, J Schneider, S Schoenfelder
28th EUPVSEC 29, 2013
Investigations of strength properties of ultra-thin silicon
S Schonfelder, J Bagdahn, M Ebert, M Petzold, K Bock, C Landesberger
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal …, 2005
A material removal coefficient for diamond wire sawing of silicon
F Wallburg, M Kuna, M Budnitzki, S Schoenfelder
Wear 504, 204400, 2022
Analysis of photoelastic properties of monocrystalline silicon
M Stoehr, G Gerlach, T Härtling, S Schoenfelder
Journal of Sensors and Sensor Systems 9 (2), 209-217, 2020
A novel parameter for the prediction of pedicle screw fixation in cancellous bone-A biomechanical study on synthetic foam
M Weidling, C Oefner, S Schoenfelder, CE Heyde
Medical Engineering & Physics 79, 44-51, 2020
Laser-assisted spalling of large-area semiconductor and solid state substrates
F Kaule, M Swoboda, C Beyer, R Rieske, A Ajaj, WD Drescher, ...
MRS Communications 8 (1), 127-131, 2018
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